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TFP201PZPG4

Texas Instruments

TFP201PZPG4 by Texas Instruments

TFP201PZPG4 by Texas Instruments is a 100-terminal consumer IC with 3.3V power supply, operating b/w 0-70°C. It features CMOS technology, GULL WING terminals, and a package style of FLATPACK for various consumer circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,926

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-

-

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Digiode

USA . 2,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,877

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 55 parts In-Stock

1+ parts

$0.463

100+ parts

-

1k+ parts

$1.612

10k+ parts

-

55

$0.463

-

$1.612

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DigiPath Technology Company

USA . 1,294 parts In-Stock

1+ parts

$0.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,294

$0.510

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-

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ChromeModa Solutions

Germany . 4,999 parts In-Stock

1+ parts

$0.520

100+ parts

$0.426

1k+ parts

-

10k+ parts

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4,999

$0.520

$0.426

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IDEA Electronic Components Group

UK . 2,064 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

$0.468

10k+ parts

-

2,064

$0.520

-

$0.468

-

AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$13.057

100+ parts

-

1k+ parts

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10k+ parts

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852

$13.057

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-

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One Stop Electronics

USA . 597 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

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10k+ parts

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597

$18.800

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Corphita

USA . 4,739 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,739

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Overview

Experience unparalleled quality and innovation with the TFP201PZPG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge solutions for consumer circuit applications like no other. This product offers customers exceptional value, benefits, and advantages, making it a top choice for your next project. With a commitment to excellence and a dedication to customer satisfaction, Texas Instruments sets the standard for reliability and performance. Elevate your designs with the TFP201PZPG4 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

A plastic/epoxy package body offers good protection for the internal components of the IC, ensuring reliability and longevity.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the IC onto circuit boards, saving space and enabling automated manufacturing processes.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC is likely to have features tailored to meet the demands of consumer electronics, making it a suitable choice for various consumer electronic products.

Power Supplies (V): 3.3

Operating at a power supply voltage of 3.3V, this IC is compatible with a wide range of systems and can provide efficient power management for consumer electronics.

No. of Terminals: 100

With 100 terminals, this IC offers a high level of connectivity for interfacing with other components or devices, allowing for versatile applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this IC can withstand demanding environmental conditions and operate reliably in various settings.

Minimum Operating Temperature: 0 °C

Operating down to 0°C, this IC is suitable for use in a wide range of temperature environments, ensuring performance in both cold and hot conditions.

Technology: CMOS

Utilizing CMOS technology, this IC offers low power consumption and high noise immunity, making it energy-efficient and reliable for consumer applications.

Technical Specifications

Other Function Consumer ICs TFP201PZPG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

350 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TFP201PZPG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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