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TFP201APZP

Texas Instruments

TFP201APZP by Texas Instruments

TFP201APZP by Texas Instruments is a consumer IC with 100 terminals, operating at 3.3V. It features a flatpack package style, CMOS technology, and can handle temperatures from 0 to 70°C. Ideal for various consumer circuit applications requiring compact design and high performance.

Median Price

$10.287

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,491 parts In-Stock

1+ parts

-

100+ parts

$8.230

1k+ parts

$7.360

10k+ parts

$6.930

20,491

-

$8.230

$7.360

$6.930

DigiKey

USA . 20,491 parts In-Stock

1+ parts

-

100+ parts

$10.830

1k+ parts

-

10k+ parts

-

20,491

-

$10.830

-

-

Verical

USA . 19,996 parts In-Stock

1+ parts

-

100+ parts

$10.287

1k+ parts

$9.200

10k+ parts

$8.662

19,996

-

$10.287

$9.200

$8.662

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,355 parts In-Stock

1+ parts

$7.543

100+ parts

-

1k+ parts

-

10k+ parts

-

4,355

$7.543

-

-

-

Vyrian

USA . 4,211 parts In-Stock

1+ parts

$7.940

100+ parts

-

1k+ parts

-

10k+ parts

-

4,211

$7.940

-

-

-

Bristol Electronics

USA . 60 parts In-Stock

1+ parts

$9.372

100+ parts

$5.857

1k+ parts

-

10k+ parts

-

60

$9.372

$5.857

-

-

Resion

USA . 328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

328

-

-

-

-

Cyclops Electronics Ltd

UK . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Holdelec - ElecDif-Pro

France . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Dan-Mar Components

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

LWI Electronics Inc

India . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,744 parts In-Stock

1+ parts

$1.566

100+ parts

-

1k+ parts

$2.209

10k+ parts

-

1,744

$1.566

-

$2.209

-

IDEA Electronic Components Group

UK . 1,642 parts In-Stock

1+ parts

$1.760

100+ parts

-

1k+ parts

$1.584

10k+ parts

-

1,642

$1.760

-

$1.584

-

ChromeModa Solutions

Germany . 1,148 parts In-Stock

1+ parts

$1.760

100+ parts

$1.443

1k+ parts

-

10k+ parts

-

1,148

$1.760

$1.443

-

-

Component Stockers USA

USA . 25,513 parts In-Stock

1+ parts

$4.900

100+ parts

$4.660

1k+ parts

$4.510

10k+ parts

$6.950

25,513

$4.900

$4.660

$4.510

$6.950

Corphita

USA . 4,149 parts In-Stock

1+ parts

$7.146

100+ parts

-

1k+ parts

-

10k+ parts

-

4,149

$7.146

-

-

-

Microchip USA

USA . 155 parts In-Stock

1+ parts

$24.530

100+ parts

$24.360

1k+ parts

$24.360

10k+ parts

$24.180

155

$24.530

$24.360

$24.360

$24.180

A-Z Elektronik GmbH

Germany . 7,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,020

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

DigiPath Technology Company

USA . 1,235 parts In-Stock

1+ parts

-

100+ parts

$1.587

1k+ parts

-

10k+ parts

-

1,235

-

$1.587

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Perfect Parts

USA . 265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

265

-

-

-

-

ChipstoGo Electronic ltd

UK . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Overview

Elevate your consumer electronics with the TFP201APZP by Texas Instruments, a top-tier manufacturer known for quality and reliability. This versatile IC offers endless possibilities in various applications, providing customers with exceptional value and performance. With a wide operating temperature range, high supply voltage, and advanced CMOS technology, this product is designed to exceed expectations. Trust Texas Instruments to deliver cutting-edge solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer applications.

Surface Mount: YES

The surface mount capability makes the product suitable for automated assembly processes, increasing efficiency and reducing production costs.

Power Supplies (V): 3.3

The operating voltage of 3.3V is commonly used in consumer electronics, making this IC compatible with a wide range of devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The variety of package styles allows for flexibility in design and integration, catering to different space and cooling requirements.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making the IC efficient and reliable for consumer applications.

Technical Specifications

Other Function Consumer ICs TFP201APZP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

350 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TFP201APZP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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