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TFP201CPZP

Texas Instruments

TFP201CPZP by Texas Instruments

TFP201CPZP by Texas Instruments is a 3.3V CONSUMER CIRCUIT IC with 100 terminals in a SQUARE package. It operates b/w 0-70°C, suitable for COMMERCIAL applications. The FLATPACK style IC is surface mountable and has a terminal pitch of 0.5mm, making it ideal for compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,143

-

-

-

-

Digiode

USA . 4,708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,708

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,036 parts In-Stock

1+ parts

$3.268

100+ parts

$303.491

1k+ parts

$2.941

10k+ parts

-

2,036

$3.268

$303.491

$2.941

-

DigiPath Technology Company

USA . 2,166 parts In-Stock

1+ parts

$3.599

100+ parts

-

1k+ parts

-

10k+ parts

-

2,166

$3.599

-

-

-

ChromeModa Solutions

Germany . 6,459 parts In-Stock

1+ parts

$3.672

100+ parts

$3.011

1k+ parts

-

10k+ parts

-

6,459

$3.672

$3.011

-

-

IDEA Electronic Components Group

UK . 2,021 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

$3.305

10k+ parts

-

2,021

$3.672

-

$3.305

-

AZTECH Wire

Italy . 211 parts In-Stock

1+ parts

$11.453

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$11.453

-

-

-

One Stop Electronics

USA . 291 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

-

10k+ parts

-

291

$14.800

-

-

-

Corphita

USA . 2,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,925

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-

-

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Overview

Discover the cutting-edge TFP201CPZP by Texas Instruments, a top-tier manufacturer known for excellence in consumer ICs. This versatile product boasts a variety of applications and features, making it an essential component for electronics enthusiasts. With a package style that includes a thin profile and a sleek design, this IC provides high performance while staying compact. Offering a wide operating temperature range and reliable power supplies, the TFP201CPZP delivers unmatched quality and value to customers seeking top-notch electronic solutions. Upgrade your projects with this innovative product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the IC, making it durable and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and labor costs.

Package Shape: SQUARE

Square package shape enables more efficient use of board space and facilitates easier PCB layout.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with a wide range of devices and power sources.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and flexibility in circuit design.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Multiple package styles offer versatility in mounting options and thermal management, catering to different application requirements.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the IC can withstand extended use in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in colder environments.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connectivity, enhancing the ease of installation and maintenance.

Maximum Seated Height: 1.2 mm

Low seated height enables a compact and slim design, ideal for space-constrained applications.

Width: 14 mm

A width of 14mm provides a balance between size and functionality, fitting well within standard PCB layouts.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V ensures efficient power consumption and compatibility with low-power systems.

Length: 14 mm

A length of 14mm complements the compact width, allowing for a well-proportioned and space-efficient package.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature ranges, suitable for most consumer applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form simplifies PCB assembly and soldering, enhancing the overall manufacturing process.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and precise connections, optimizing PCB layout efficiency.

Maximum Supply Voltage (Vsup): 3.6 V

Operating at a maximum supply voltage of 3.6V ensures safe operation within specified limits, protecting the IC from overvoltage conditions.

Technical Specifications

Other Function Consumer ICs TFP201CPZP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TFP201CPZP General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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