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TFP201ACPZP

Texas Instruments

TFP201ACPZP by Texas Instruments

TFP201ACPZP by Texas Instruments is a 3.3V CONSUMER CIRCUIT IC with 100 terminals in a SQUARE package. It operates b/w 0-70°C, suitable for COMMERCIAL applications requiring a thin profile and fine pitch design. This PLASTIC/EPOXY IC is surface mountable and has GULL WING terminals with a 0.5mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,276

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-

-

-

Digiode

USA . 4,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,830

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,429 parts In-Stock

1+ parts

$2.639

100+ parts

-

1k+ parts

$3.128

10k+ parts

-

1,429

$2.639

-

$3.128

-

DigiPath Technology Company

USA . 1,080 parts In-Stock

1+ parts

$2.906

100+ parts

$2.673

1k+ parts

-

10k+ parts

-

1,080

$2.906

$2.673

-

-

ChromeModa Solutions

Germany . 5,866 parts In-Stock

1+ parts

$2.965

100+ parts

$2.431

1k+ parts

-

10k+ parts

-

5,866

$2.965

$2.431

-

-

IDEA Electronic Components Group

UK . 273 parts In-Stock

1+ parts

$2.965

100+ parts

-

1k+ parts

$2.668

10k+ parts

-

273

$2.965

-

$2.668

-

AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$6.127

100+ parts

-

1k+ parts

-

10k+ parts

-

894

$6.127

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-

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One Stop Electronics

USA . 375 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$18.800

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-

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Corphita

USA . 2,844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,844

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-

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Overview

Enhance your consumer electronics with the TFP201ACPZP by Texas Instruments. Manufactured to the highest standards, this versatile IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this consumer circuit provides seamless integration and superior performance. Experience the value and benefits of this product, from its compact design to its innovative technology. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations. Elevate your products with the TFP201ACPZP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape is compact and allows for efficient use of space on a circuit board.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, making it compatible with many existing systems and components.

No. of Terminals: 100

Having a high number of terminals allows for more connections and functionality in the circuit design.

Maximum Operating Temperature: 70 °C

Can operate at relatively high temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Able to function in low temperatures, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Other Function Consumer ICs TFP201ACPZP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TFP201ACPZP General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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