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TDES960RTDR

Texas Instruments

TDES960RTDR by Texas Instruments

TDES960RTDR by Texas Instruments is a 64-terminal consumer IC with a package style of chip carrier. It operates b/w -20°C to 85°C, with a terminal pitch of 0.5mm. Ideal for applications requiring very thin profile and surface mount compatibility.

Median Price

$12.035

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,077 parts In-Stock

1+ parts

$12.035

100+ parts

$10.513

1k+ parts

$7.250

10k+ parts

-

6,077

$12.035

$10.513

$7.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,966 parts In-Stock

1+ parts

$11.433

100+ parts

-

1k+ parts

-

10k+ parts

-

1,966

$11.433

-

-

-

Vyrian

USA . 7,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,001

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 211 parts In-Stock

1+ parts

$2.237

100+ parts

-

1k+ parts

$2.741

10k+ parts

-

211

$2.237

-

$2.741

-

DigiPath Technology Company

USA . 1,040 parts In-Stock

1+ parts

$2.464

100+ parts

$2.267

1k+ parts

-

10k+ parts

-

1,040

$2.464

$2.267

-

-

ChromeModa Solutions

Germany . 1,764 parts In-Stock

1+ parts

$2.514

100+ parts

$2.061

1k+ parts

-

10k+ parts

-

1,764

$2.514

$2.061

-

-

IDEA Electronic Components Group

UK . 998 parts In-Stock

1+ parts

$2.514

100+ parts

-

1k+ parts

$2.263

10k+ parts

-

998

$2.514

-

$2.263

-

Corphita

USA . 1,994 parts In-Stock

1+ parts

$10.832

100+ parts

-

1k+ parts

-

10k+ parts

-

1,994

$10.832

-

-

-

AZTECH Wire

Italy . 446 parts In-Stock

1+ parts

$12.540

100+ parts

-

1k+ parts

-

10k+ parts

-

446

$12.540

-

-

-

Microchip USA

USA . 4,281 parts In-Stock

1+ parts

$27.000

100+ parts

$26.610

1k+ parts

$26.420

10k+ parts

$26.230

4,281

$27.000

$26.610

$26.420

$26.230

Overview

Unleash the power of innovation with the TDES960RTDR by Texas Instruments. Crafted with precision and expertise, this consumer IC offers unmatched quality and reliability. From its durable plastic/epoxy body to its advanced chip carrier package style, this versatile device is designed to excel in a variety of applications. Experience superior performance and efficiency with Texas Instruments' cutting-edge technology. Elevate your projects to new heights with the TDES960RTDR, where value meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

The surface mount feature makes it easy to integrate into a variety of electronic devices.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding conditions.

Minimum Operating Temperature: -20 °C

The wide range of operating temperatures makes this product suitable for different environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish of nickel palladium gold silver enhances conductivity and reliability.

Width: 9 mm

The compact width allows for easy integration into various electronic devices.

Minimum Supply Voltage (Vsup): 1.045 V

The low minimum supply voltage ensures efficient power consumption.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting on circuit boards.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates a moderate level of protection against moisture.

Technical Specifications

Other Function Consumer ICs TDES960RTDR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TDES960RTDR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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