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TDES960RTDT

Texas Instruments

TDES960RTDT by Texas Instruments

TDES960RTDT by Texas Instruments is a 64-terminal consumer IC with a package style of chip carrier. It operates b/w -20 to 85°C, with a terminal pitch of 0.5mm. Ideal for applications requiring very thin profile and surface mount compatibility.

Median Price

$14.442

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,649 parts In-Stock

1+ parts

$14.442

100+ parts

$12.615

1k+ parts

$8.700

10k+ parts

-

1,649

$14.442

$12.615

$8.700

-

Mouser Electronics

USA . 938 parts In-Stock

1+ parts

$20.780

100+ parts

$15.370

1k+ parts

$13.400

10k+ parts

-

938

$20.780

$15.370

$13.400

-

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.750

10k+ parts

-

250

-

-

$11.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 137 parts In-Stock

1+ parts

$11.750

100+ parts

-

1k+ parts

-

10k+ parts

-

137

$11.750

-

-

-

Digiode

USA . 1,471 parts In-Stock

1+ parts

$13.720

100+ parts

-

1k+ parts

-

10k+ parts

-

1,471

$13.720

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,747 parts In-Stock

1+ parts

$1.116

100+ parts

-

1k+ parts

$1.946

10k+ parts

-

1,747

$1.116

-

$1.946

-

ChromeModa Solutions

Germany . 6,176 parts In-Stock

1+ parts

$1.254

100+ parts

$1.028

1k+ parts

-

10k+ parts

-

6,176

$1.254

$1.028

-

-

IDEA Electronic Components Group

UK . 2,170 parts In-Stock

1+ parts

$1.254

100+ parts

-

1k+ parts

$1.129

10k+ parts

-

2,170

$1.254

-

$1.129

-

Corphita

USA . 2,356 parts In-Stock

1+ parts

$12.998

100+ parts

-

1k+ parts

-

10k+ parts

-

2,356

$12.998

-

-

-

Lixinc

USA . 12,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,297

-

-

-

-

DigiPath Technology Company

USA . 1,169 parts In-Stock

1+ parts

-

100+ parts

$1.131

1k+ parts

-

10k+ parts

-

1,169

-

$1.131

-

-

Overview

Discover the TDES960RTDT by Texas Instruments, a high-quality consumer IC that offers unmatched performance and reliability. Manufactured by a trusted industry leader, this chip provides endless applications in various electronics devices. With its compact square shape and advanced features, this IC is a game-changer in the market. Customers can trust in the value, benefits, and advantages that come with choosing this cutting-edge product. Upgrade your electronics with the TDES960RTDT and experience unparalleled innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it suitable for a variety of consumer applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can perform reliably even in demanding environments.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C ensures versatility and functionality in various conditions.

No. of Terminals: 64

With 64 terminals, this IC provides ample connectivity options for different circuit configurations.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of high-quality terminal finishes like nickel, palladium, gold, and silver enhances conductivity and ensures long-term reliability.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC has moderate sensitivity to moisture, suitable for standard manufacturing and handling practices.

Maximum Supply Voltage (Vsup): 1.155 V

The maximum supply voltage of 1.155 V allows for efficient power management and compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs TDES960RTDT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TDES960RTDT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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