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TCAN1051VDQ1

Texas Instruments

TCAN1051VDQ1 by Texas Instruments

TCAN1051VDQ1 by Texas Instruments is a Network Interface IC with AEC-Q100 screening. It operates b/w -55 to 125°C, supports 2 Mbps data rate, and has a supply current of 180 mA. Ideal for automotive applications due to its MILITARY temperature grade and small outline package style.

Median Price

$2.055

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 765 parts In-Stock

1+ parts

$1.740

100+ parts

$1.477

1k+ parts

$1.034

10k+ parts

$0.857

765

$1.740

$1.477

$1.034

$0.857

Mouser Electronics

USA . 184 parts In-Stock

1+ parts

$2.370

100+ parts

$1.710

1k+ parts

$1.400

10k+ parts

$1.290

184

$2.370

$1.710

$1.400

$1.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,495 parts In-Stock

1+ parts

$2.252

100+ parts

-

1k+ parts

-

10k+ parts

-

3,495

$2.252

-

-

-

Vyrian

USA . 5,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,884

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 36 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.950

10k+ parts

-

36

$2.010

$1.960

$1.950

-

Corphita

USA . 3,132 parts In-Stock

1+ parts

$2.133

100+ parts

-

1k+ parts

-

10k+ parts

-

3,132

$2.133

-

-

-

Component Stockers USA

USA . 3,652 parts In-Stock

1+ parts

$2.310

100+ parts

$1.670

1k+ parts

$7.810

10k+ parts

-

3,652

$2.310

$1.670

$7.810

-

Corohmni

South Africa . 336 parts In-Stock

1+ parts

$2.370

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$2.370

-

-

-

Parana Technologies

USA . 2,180 parts In-Stock

1+ parts

$8.493

100+ parts

-

1k+ parts

$9.147

10k+ parts

-

2,180

$8.493

-

$9.147

-

ChromeModa Solutions

Germany . 2,171 parts In-Stock

1+ parts

$9.543

100+ parts

$7.825

1k+ parts

-

10k+ parts

-

2,171

$9.543

$7.825

-

-

IDEA Electronic Components Group

UK . 2,010 parts In-Stock

1+ parts

$9.543

100+ parts

$9.066

1k+ parts

$8.589

10k+ parts

-

2,010

$9.543

$9.066

$8.589

-

Microchip USA

USA . 1,546 parts In-Stock

1+ parts

$9.681

100+ parts

-

1k+ parts

-

10k+ parts

-

1,546

$9.681

-

-

-

DigiPath Technology Company

USA . 2,266 parts In-Stock

1+ parts

-

100+ parts

$8.604

1k+ parts

-

10k+ parts

-

2,266

-

$8.604

-

-

A-Z Elektronik GmbH

Germany . 128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

128

-

-

-

-

iodParts Technologies Inc.

India . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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75

-

-

-

-

Overview

Enhance your network interfaces with the TCAN1051VDQ1 by Texas Instruments. Crafted with precision and expertise, this product boasts top-quality materials and innovative design. Ideal for a wide range of applications, this small outline package offers maximum reliability and performance in extreme conditions. Take advantage of its military-grade temperature grade, high data rate capabilities, and low supply current to optimize your telecom IC interface circuits. Trust Texas Instruments to deliver unparalleled value and superior products that will elevate your networking experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and resistance to extreme temperatures, making this product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and secure installation, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high quality and reliability, making this product ideal for automotive applications where stringent standards are required.

Package Shape: RECTANGULAR

Rectangular shape offers efficient use of space and easy integration into existing systems or devices.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for various interfaces, enhancing versatility and compatibility.

Package Style (Meter): SMALL OUTLINE

Small outline package style conserves space and makes it suitable for compact designs or tight installations.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh conditions or elevated temperatures.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature enables this product to function in extreme cold environments without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, palladium, and gold finish provides excellent conductivity, corrosion resistance, and solderability for long-term reliability and performance.

Terminal Position: DUAL

Dual terminal position allows for increased stability and better electrical connections, enhancing overall product reliability.

Maximum Seated Height: 1.75 mm

Low maximum seated height saves space and allows for slim designs or tight spaces in electronic assemblies.

Width: 3.895 mm

Narrow width provides flexibility for placement on PCBs or in compact devices, optimizing layout and design options.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure and reliable soldering during manufacturing processes, reducing the risk of connection failures.

Length: 4.905 mm

Compact length saves space and allows for efficient placement in electronic circuits or systems.

Temperature Grade: MILITARY

Military-grade temperature rating ensures resilience in extreme conditions and meets stringent performance standards for mission-critical applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and stability during soldering and assembly processes, enhancing product reliability and longevity.

Maximum Supply Current: 180 mA

High maximum supply current capacity supports multiple devices or components connected to this network interface, ensuring consistent and reliable power delivery.

Telecom IC Type: INTERFACE CIRCUIT

Interface circuit telecom IC type enables seamless communication between different devices or networks, ensuring compatibility and efficient data transfer.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage ensures consistent and reliable operation of the network interface with compatible devices or systems.

Terminal Pitch: 1.27 mm

Optimal terminal pitch provides secure connections and efficient signal transmission, reducing the risk of signal loss or interference.

Data Rate: 2 Mbps

High data rate of 2 Mbps enables fast and efficient data transfer, suitable for demanding applications or high-speed communication requirements.

Technical Specifications

Network Interfaces TCAN1051VDQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

2 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

180 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.895 mm

Trade Compliance

TCAN1051VDQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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