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TCAN1051GDRBRQ1

Texas Instruments

TCAN1051GDRBRQ1 by Texas Instruments

TCAN1051GDRBRQ1 by Texas Instruments is a network interface IC with AEC-Q100 screening. It operates b/w -55 to 125°C, has 8 terminals, and supports a data rate of 5 Mbps. Ideal for automotive applications due to its MILITARY temperature grade and small form factor.

Median Price

$1.404

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 28,889 parts In-Stock

1+ parts

$1.404

100+ parts

$1.160

1k+ parts

$0.627

10k+ parts

-

28,889

$1.404

$1.160

$0.627

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$0.796

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$0.796

-

-

-

Digiode

USA . 3,006 parts In-Stock

1+ parts

$1.334

100+ parts

-

1k+ parts

-

10k+ parts

-

3,006

$1.334

-

-

-

Maritex

Poland . 6,000 parts In-Stock

1+ parts

$1.524

100+ parts

$0.930

1k+ parts

$0.739

10k+ parts

-

6,000

$1.524

$0.930

$0.739

-

Vyrian

USA . 6,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,445

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,113 parts In-Stock

1+ parts

$0.796

100+ parts

-

1k+ parts

-

10k+ parts

$0.780

6,113

$0.796

-

-

$0.780

Argo Parts USA

USA . 2,562 parts In-Stock

1+ parts

$0.796

100+ parts

-

1k+ parts

-

10k+ parts

-

2,562

$0.796

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.796

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.796

-

-

-

Ampacity Inc.

Singapore . 28,697 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

28,697

$1.190

-

-

-

Semicontronic

India . 28,694 parts In-Stock

1+ parts

$1.190

100+ parts

$1.160

1k+ parts

$1.154

10k+ parts

-

28,694

$1.190

$1.160

$1.154

-

Corphita

USA . 4,494 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

-

10k+ parts

-

4,494

$1.264

-

-

-

AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$8.390

100+ parts

-

1k+ parts

-

10k+ parts

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506

$8.390

-

-

-

Aztec Data Supply Inc.

USA . 255 parts In-Stock

1+ parts

$9.630

100+ parts

-

1k+ parts

-

10k+ parts

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255

$9.630

-

-

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Parana Technologies

USA . 1,348 parts In-Stock

1+ parts

$13.551

100+ parts

-

1k+ parts

$14.055

10k+ parts

-

1,348

$13.551

-

$14.055

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ChromeModa Solutions

Germany . 5,351 parts In-Stock

1+ parts

$15.226

100+ parts

$12.485

1k+ parts

-

10k+ parts

-

5,351

$15.226

$12.485

-

-

IDEA Electronic Components Group

UK . 1,746 parts In-Stock

1+ parts

$15.226

100+ parts

$14.465

1k+ parts

$13.703

10k+ parts

-

1,746

$15.226

$14.465

$13.703

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Lixinc

USA . 2,156 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,156

-

-

-

-

DigiPath Technology Company

USA . 1,335 parts In-Stock

1+ parts

-

100+ parts

$13.728

1k+ parts

-

10k+ parts

-

1,335

-

$13.728

-

-

Overview

Enhance your network interface capabilities with the TCAN1051GDRBRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This product is ideal for a wide range of applications, offering customers seamless connectivity and superior performance. Trust in the value, benefits, and advantages this versatile device brings to your projects. Elevate your networking experience with the TCAN1051GDRBRQ1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and lightweight properties, making the product suitable for various applications without compromising on strength.

Surface Mount: YES

The surface mount design allows for easy and efficient installation, saving time and effort during assembly.

Screening Level: AEC-Q100

Compliance with the AEC-Q100 standard ensures high reliability and quality, making it suitable for automotive applications where robust performance is crucial.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the product to withstand harsh environmental conditions, increasing its versatility and reliability.

Data Rate: 5 Mbps

The high data rate capability of 5 Mbps ensures fast and efficient data transmission, making it ideal for applications requiring quick communication.

Technical Specifications

Network Interfaces TCAN1051GDRBRQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

5 Mbps

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

180 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TCAN1051GDRBRQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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