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TCAN1051DRBTQ1

Texas Instruments

TCAN1051DRBTQ1 by Texas Instruments

TCAN1051DRBTQ1 by Texas Instruments is a Network Interface IC with AEC-Q100 screening. It operates b/w -55 to 125°C, supports 2 Mbps data rate, and has a max supply current of 180 mA. Ideal for automotive applications due to its MILITARY temperature grade and small outline package style.

Median Price

$1.620

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,957 parts In-Stock

1+ parts

$1.620

100+ parts

$1.338

1k+ parts

$0.723

10k+ parts

-

15,957

$1.620

$1.338

$0.723

-

DigiKey

USA . 503 parts In-Stock

1+ parts

$2.500

100+ parts

$1.519

1k+ parts

$1.359

10k+ parts

$1.265

503

$2.500

$1.519

$1.359

$1.265

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.045

10k+ parts

$0.890

1,000

-

-

$1.045

$0.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.110

-

-

-

Digiode

USA . 2,225 parts In-Stock

1+ parts

$1.539

100+ parts

-

1k+ parts

-

10k+ parts

-

2,225

$1.539

-

-

-

Vyrian

USA . 3,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,716

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,606 parts In-Stock

1+ parts

$0.890

100+ parts

$0.868

1k+ parts

$0.863

10k+ parts

-

5,606

$0.890

$0.868

$0.863

-

Ampacity Inc.

Singapore . 5,395 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

-

5,395

$0.890

-

-

-

Continental Prestige Electronics

USA . 6,826 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

$1.088

6,826

$1.110

-

-

$1.088

Argo Parts USA

USA . 976 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

-

976

$1.110

-

-

-

Corohmni

South Africa . 1,016 parts In-Stock

1+ parts

$1.341

100+ parts

-

1k+ parts

-

10k+ parts

-

1,016

$1.341

-

-

-

Corphita

USA . 3,944 parts In-Stock

1+ parts

$1.458

100+ parts

-

1k+ parts

-

10k+ parts

-

3,944

$1.458

-

-

-

Parana Technologies

USA . 1,086 parts In-Stock

1+ parts

$7.266

100+ parts

-

1k+ parts

$7.766

10k+ parts

-

1,086

$7.266

-

$7.766

-

DigiPath Technology Company

USA . 464 parts In-Stock

1+ parts

$8.001

100+ parts

-

1k+ parts

-

10k+ parts

-

464

$8.001

-

-

-

ChromeModa Solutions

Germany . 3,055 parts In-Stock

1+ parts

$8.164

100+ parts

$6.694

1k+ parts

-

10k+ parts

-

3,055

$8.164

$6.694

-

-

IDEA Electronic Components Group

UK . 2,020 parts In-Stock

1+ parts

$8.164

100+ parts

-

1k+ parts

$7.348

10k+ parts

-

2,020

$8.164

-

$7.348

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

A-Z Elektronik GmbH

Germany . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Overview

Experience the reliability and performance of Texas Instruments with the TCAN1051DRBTQ1, a cutting-edge Network Interface perfect for various applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product delivers quality and precision. Whether you're in automotive, industrial, or consumer electronics, this small outline package offers a compact solution with a very thin profile. Benefit from its wide operating temperature range and high data rate, making it a versatile and efficient choice for your design needs. Upgrade your project with the TCAN1051DRBTQ1 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the product can withstand demanding environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and solderability.

Temperature Grade: MILITARY

Military grade temperature rating indicates high reliability and performance in tough operating conditions.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage makes it compatible with most systems.

Data Rate: 2 Mbps

Fast data rate of 2 Mbps allows for efficient data transmission.

Technical Specifications

Network Interfaces TCAN1051DRBTQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

2 Mbps

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

180 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TCAN1051DRBTQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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