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TCA6408PWG4

Texas Instruments

TCA6408PWG4 by Texas Instruments

TCA6408PWG4 by Texas Instruments is an 8-bit parallel I/O port with a supply voltage range of 1.65V to 5.5V, suitable for industrial applications. It features a small outline package with dual terminals and operates in temperatures ranging from -40°C to 85°C. This CMOS technology-based device offers 8 I/O lines and is ideal for general-purpose peripheral IC applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,746 parts In-Stock

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4,746

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Digiode

USA . 1,118 parts In-Stock

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1,118

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Nova Conductors

Japan . 93 parts In-Stock

1+ parts

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93

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Netsource Technology, Inc.

USA . 38 parts In-Stock

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38

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 401 parts In-Stock

1+ parts

$1.000

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-

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401

$1.000

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AZTECH Wire

Italy . 795 parts In-Stock

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$18.650

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795

$18.650

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Parana Technologies

USA . 300 parts In-Stock

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$27.414

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$35.580

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300

$27.414

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$35.580

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DigiPath Technology Company

USA . 1,030 parts In-Stock

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$30.186

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1,030

$30.186

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ChromeModa Solutions

Germany . 1,668 parts In-Stock

1+ parts

$30.802

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$25.258

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1,668

$30.802

$25.258

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IDEA Electronic Components Group

UK . 835 parts In-Stock

1+ parts

$30.802

100+ parts

$29.262

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$27.722

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835

$30.802

$29.262

$27.722

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One Stop Electronics

USA . 645 parts In-Stock

1+ parts

$35.000

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645

$35.000

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Corohmni

South Africa . 974 parts In-Stock

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$82.019

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974

$82.019

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Corphita

USA . 4,522 parts In-Stock

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Microchip USA

USA . 438 parts In-Stock

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438

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Aranea Global

USA . 100 parts In-Stock

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Overview

Elevate your projects with the TCA6408PWG4 by Texas Instruments, a high-quality Parallel I/O Ports device designed to enhance functionality and efficiency. Manufactured by industry leader Texas Instruments, this product offers unparalleled value and reliability. Perfect for a wide range of applications, this versatile device boasts 8 bits and dual terminal positions, making it ideal for general purpose parallel I/O port functions. Trust Texas Instruments to deliver cutting-edge technology and superior performance with the TCA6408PWG4. Upgrade your projects today and experience the difference!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount:

YES - This feature allows for easy installation and integration into existing systems.

Maximum Supply Voltage:

5.5 V - Provides a wide range of voltage options for versatile applications.

Package Shape:

RECTANGULAR - This shape allows for efficient use of space and easy placement on circuit boards.

No. of Bits:

8 - Provides ample capacity for data transfer and processing.

Power Supplies (V):

1.8/5 - Offers flexibility in power requirements for different use cases.

No. of Terminals:

16 - Provides multiple connection points for enhanced functionality.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Compact design for space-saving installation.

Minimum Supply Voltage:

1.65 V - Ensures compatibility with lower voltage systems.

Maximum Operating Temperature:

85 °C - Can withstand high temperatures for reliable performance in various environments.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Resistant to corrosion and provides a reliable connection.

Terminal Position:

DUAL - Allows for multiple connection options for flexibility in setup.

Maximum Seated Height:

1.2 mm - Low profile design for compact installations.

Width:

4.4 mm - Slim design for space-efficient placement on circuit boards.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures stable performance during reflow processes.

Peak Reflow Temperature °C:

260 - Withstands high temperatures during reflow soldering.

Length:

5 mm - Compact size for efficient use of space.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications with varying temperature requirements.

Peripheral IC Type:

PARALLEL IO PORT, GENERAL PURPOSE - Versatile IC type for a wide range of applications.

Technology:

CMOS - Offers low power consumption and high-speed operation.

Terminal Form:

GULL WING - Provides secure and reliable connections.

Nominal Supply Voltage:

1.8 V - Consistent voltage supply for stable performance.

Terminal Pitch:

0.65 mm - Allows for precise and secure connections.

No. of I/O Lines:

8 - Sufficient I/O lines for data transfer and communication.

Technical Specifications

Parallel I/O Ports TCA6408PWG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TCA6408PWG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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