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TB5R1LDR

Texas Instruments

TB5R1LDR by Texas Instruments

TB5R1LDR by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 5V. It features a max output low current of 8A and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring high-speed data transmission and reliable signal amplification.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,067 parts In-Stock

1+ parts

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6,067

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Digiode

USA . 925 parts In-Stock

1+ parts

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925

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 868 parts In-Stock

1+ parts

$12.581

100+ parts

-

1k+ parts

$13.033

10k+ parts

-

868

$12.581

-

$13.033

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DigiPath Technology Company

USA . 566 parts In-Stock

1+ parts

$13.853

100+ parts

$12.745

1k+ parts

-

10k+ parts

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566

$13.853

$12.745

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ChromeModa Solutions

Germany . 5,857 parts In-Stock

1+ parts

$14.136

100+ parts

$11.592

1k+ parts

-

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5,857

$14.136

$11.592

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IDEA Electronic Components Group

UK . 1,999 parts In-Stock

1+ parts

$14.136

100+ parts

$13.429

1k+ parts

$12.722

10k+ parts

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1,999

$14.136

$13.429

$12.722

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AZTECH Wire

Italy . 879 parts In-Stock

1+ parts

$18.038

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879

$18.038

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One Stop Electronics

USA . 812 parts In-Stock

1+ parts

$43.500

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812

$43.500

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Corphita

USA . 774 parts In-Stock

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774

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Overview

Enhance your electronic projects with the TB5R1LDR Line Driver by Texas Instruments. Crafted with precision and expertise, this small outline package offers exceptional performance and reliability. Ideal for a wide range of applications, from industrial automation to telecommunications, this line driver ensures seamless signal transmission. With a nominal supply voltage of 5V and maximum output low current of 8A, the TB5R1LDR is designed to meet your needs with efficiency and ease. Trust in Texas Instruments for quality products that deliver value and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for long-term use in various applications.

Surface Mount: YES

Surface mount design allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes the product compatible with common power sources and ensures reliable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand heat and operate in harsh environments without compromising performance.

Technology: BIPOLAR

Bipolar technology ensures fast and accurate signal transmission, making the product suitable for high-speed data communication applications.

Technical Specifications

Line Drivers & Receivers TB5R1LDR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TB5R1LDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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