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TB5R2DWE4

Texas Instruments

TB5R2DWE4 by Texas Instruments

TB5R2DWE4 by Texas Instruments is a Line Receiver IC with 4 functions, operating at 5V. It features a max supply voltage of 5.5V and operates in industrial temperature range (-40 to 85°C). With a small outline package style, it is suitable for applications requiring differential Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,762 parts In-Stock

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6,762

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Digiode

USA . 1,764 parts In-Stock

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1,764

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,663 parts In-Stock

1+ parts

$8.527

100+ parts

-

1k+ parts

$9.184

10k+ parts

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1,663

$8.527

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$9.184

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DigiPath Technology Company

USA . 336 parts In-Stock

1+ parts

$9.389

100+ parts

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336

$9.389

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IDEA Electronic Components Group

UK . 521 parts In-Stock

1+ parts

$9.581

100+ parts

$9.102

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$8.623

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521

$9.581

$9.102

$8.623

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ChromeModa Solutions

Germany . 292 parts In-Stock

1+ parts

$9.581

100+ parts

$7.856

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292

$9.581

$7.856

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AZTECH Wire

Italy . 736 parts In-Stock

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$14.355

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736

$14.355

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One Stop Electronics

USA . 261 parts In-Stock

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$31.500

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261

$31.500

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Corphita

USA . 4,699 parts In-Stock

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Overview

Experience unmatched quality and reliability with the TB5R2DWE4 by Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line Line Driver & Receiver, this product offers exceptional performance and versatility for various applications. With its high-quality construction and innovative design, customers can expect seamless operation and superior functionality. Trust Texas Instruments to deliver value, benefits, and advantages that exceed expectations, making the TB5R2DWE4 the perfect choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a long lifespan for the product.

Surface Mount: YES

Easy to install and suitable for compact electronic designs.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 4

Multiple functions make this product a cost-effective solution, as it can perform several tasks in one device.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards.

Power Supplies (V): 5

Operates at a standard voltage, making it easy to integrate into existing systems.

No. of Terminals: 16

Sufficient terminals for connecting to various components and peripherals.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the circuit board.

Minimum Supply Voltage: 4.5 V

Can function reliably even at low supply voltages.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without overheating.

Minimum Operating Temperature: -40 °C

Can function in extreme cold conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position provides flexibility for different circuit board layouts.

Maximum Seated Height: 2.65 mm

Low profile design saves space and allows for compact electronic designs.

Width: 7.5 mm

Compact width for efficient placement on the circuit board.

Maximum Output Low Current: 8 Amp

Can deliver high output current, suitable for driving power-hungry components.

Receiver No. of Bits: 4

Suitable for receiving and processing data in 4-bit format.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified period, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 250

Can withstand high reflow temperatures during assembly processes.

Length: 10.3 mm

Compact length for efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability under harsh conditions is crucial.

Maximum Receive Delay: 5 ns

Fast response time for receiving data signals, ensuring quick processing.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and easy soldering during assembly.

Maximum Supply Current: 40 mA

Low supply current consumption for energy-efficient operation.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input characteristics ensure reliable signal reception and noise immunity.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with various electronic systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connection to external components.

Moisture Sensitivity Level (MSL): 2

Low moisture sensitivity level for reliable operation in humid environments.

Interface IC Type: LINE RECEIVER

Specifically designed for receiving and processing line signals, ensuring accurate data transmission.

Technical Specifications

Line Drivers & Receivers TB5R2DWE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

5 ns

Receiver No. of Bits:

4

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TB5R2DWE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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