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TB5R1DR

Texas Instruments

TB5R1DR by Texas Instruments

TB5R1DR by Texas Instruments is a Line Receiver IC with 4 functions, operating at -40 to 85°C. It has a supply voltage range of 4.5-5.5V and max output low current of 8A. Ideal for industrial applications requiring high-speed signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,924 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,924

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Vyrian

USA . 2,313 parts In-Stock

1+ parts

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100+ parts

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2,313

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Chip Stock

USA . 186 parts In-Stock

1+ parts

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100+ parts

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186

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,232 parts In-Stock

1+ parts

$5.097

100+ parts

-

1k+ parts

$5.678

10k+ parts

-

2,232

$5.097

-

$5.678

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DigiPath Technology Company

USA . 103 parts In-Stock

1+ parts

$5.612

100+ parts

$5.163

1k+ parts

-

10k+ parts

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103

$5.612

$5.163

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ChromeModa Solutions

Germany . 4,744 parts In-Stock

1+ parts

$5.727

100+ parts

$4.696

1k+ parts

-

10k+ parts

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4,744

$5.727

$4.696

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IDEA Electronic Components Group

UK . 2,157 parts In-Stock

1+ parts

$5.727

100+ parts

-

1k+ parts

$5.154

10k+ parts

-

2,157

$5.727

-

$5.154

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AZTECH Wire

Italy . 534 parts In-Stock

1+ parts

$12.120

100+ parts

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534

$12.120

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One Stop Electronics

USA . 128 parts In-Stock

1+ parts

$37.500

100+ parts

-

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128

$37.500

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A-Z Elektronik GmbH

Germany . 7,070 parts In-Stock

1+ parts

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7,070

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Corphita

USA . 3,796 parts In-Stock

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3,796

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Kepictronics

USA . 2,197 parts In-Stock

1+ parts

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2,197

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Microchip USA

USA . 260 parts In-Stock

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260

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Overview

Unlock the potential of your electronic designs with the TB5R1DR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that provide unmatched performance and reliability. Ideal for a wide range of applications, this product offers customers exceptional value and benefits. Whether you're looking to improve signal integrity or enhance communication efficiency, the TB5R1DR is the perfect solution for all your electronic needs. Trust Texas Instruments to deliver excellence in every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring the product can withstand rough handling and environmental conditions.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, making it versatile and compatible with a wide range of systems.

No. of Functions: 4

Offers multiple functions in a single device, reducing the need for additional components and simplifying the design.

Package Shape: RECTANGULAR

Provides a standard shape for easy integration into existing designs and layouts.

Power Supplies (V): 5

Operates at a common voltage level, making it compatible with most power sources and systems.

No. of Terminals: 16

Provides multiple connection points for versatile installation and connectivity options.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the circuit board and allows for efficient use of PCB real estate.

Minimum Supply Voltage: 4.5 V

Can operate at lower voltage levels, providing flexibility in power supply requirements.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without compromising performance, suitable for industrial and harsh environment applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, ensuring reliability in a variety of environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and connectivity options.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact and space-saving installations.

Width: 3.9 mm

Narrow width saves space on the circuit board, suitable for applications with limited PCB real estate.

Maximum Output Low Current: 8 Amp

Can deliver high current output, suitable for driving loads that require more power.

Receiver No. of Bits: 4

4-bit receiver offers precise and accurate signal reception, ensuring reliable data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for a specified duration, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 250

Can withstand high reflow temperatures during assembly processes, ensuring durability and reliability.

Length: 9.9 mm

Compact length makes the product suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability and durability are essential.

Maximum Receive Delay: 5 ns

Low receive delay ensures fast and accurate signal reception, essential for real-time data transmission.

Terminal Form: GULL WING

Gull wing terminals offer reliable and easy soldering connections, ensuring secure and stable installations.

Maximum Supply Current: 40 mA

Low supply current consumption ensures energy efficiency and reduced power consumption.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input provides noise immunity and signal stability, ensuring reliable data transmission.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level, making it compatible with most systems and power sources.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration and installation on standard PCB layouts.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates the product can withstand moderate exposure to moisture during storage and handling.

Interface IC Type: LINE RECEIVER

Line receiver interface IC type ensures accurate and reliable signal reception, essential for data communication applications.

Technical Specifications

Line Drivers & Receivers TB5R1DR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

5 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TB5R1DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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