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TB5R2DE4

Texas Instruments

TB5R2DE4 by Texas Instruments

TB5R2DE4 by Texas Instruments is a Line Receiver IC with 4 functions, operating at -40 to 85°C. It has a supply voltage range of 4.5-5.5V and max output low current of 8A. Ideal for industrial applications requiring differential Schmitt trigger input characteristics in a compact small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,220 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,220

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-

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Digiode

USA . 77 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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77

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,205 parts In-Stock

1+ parts

$5.234

100+ parts

-

1k+ parts

$5.850

10k+ parts

-

2,205

$5.234

-

$5.850

-

DigiPath Technology Company

USA . 609 parts In-Stock

1+ parts

$5.763

100+ parts

-

1k+ parts

-

10k+ parts

-

609

$5.763

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ChromeModa Solutions

Germany . 4,959 parts In-Stock

1+ parts

$5.881

100+ parts

$4.822

1k+ parts

-

10k+ parts

-

4,959

$5.881

$4.822

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IDEA Electronic Components Group

UK . 1,140 parts In-Stock

1+ parts

$5.881

100+ parts

-

1k+ parts

$5.293

10k+ parts

-

1,140

$5.881

-

$5.293

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AZTECH Wire

Italy . 272 parts In-Stock

1+ parts

$10.784

100+ parts

-

1k+ parts

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10k+ parts

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272

$10.784

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One Stop Electronics

USA . 1,364 parts In-Stock

1+ parts

$22.500

100+ parts

-

1k+ parts

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10k+ parts

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1,364

$22.500

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Corphita

USA . 1,999 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,999

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Overview

Experience superior performance and reliability with the TB5R2DE4 by Texas Instruments, a cutting-edge Line Driver & Receiver designed for industrial applications. Made with high-quality materials and advanced technology, this product offers unmatched precision and efficiency. With its small outline package style and dual terminal position, the TB5R2DE4 provides seamless integration and optimal functionality. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations. Make the smart choice for your business - choose the TB5R2DE4 for unparalleled quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides high durability and protection for internal components, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and improving overall circuit reliability.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of input voltage levels, increasing the versatility of the product.

No. of Functions: 4

Offers multiple functions in a single device, reducing the need for additional components and simplifying circuit design.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit layouts and PCB designs.

Power Supplies (V): 5

Operates efficiently with a standard power supply voltage, making it suitable for a wide range of applications.

No. of Terminals: 16

Provides ample connection points for interfacing with external devices, allowing for greater flexibility in system configurations.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space on the PCB and allows for densely populated circuit designs.

Minimum Supply Voltage: 4.5 V

Ensures reliable operation even at lower supply voltages, enhancing the product's robustness.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial applications where heat resistance is crucial.

Minimum Operating Temperature: -40 °C

Functions seamlessly at low temperatures, enabling use in harsh environments or cold climates.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Facilitates secure and stable connection to the PCB, reducing the chance of signal interference or loss.

Maximum Seated Height: 1.75 mm

Low profile design minimizes board height requirements, ideal for space-constrained applications.

Width: 3.9 mm

Compact width enables efficient use of PCB real estate, contributing to compact and streamlined circuit layouts.

Maximum Output Low Current: 8 Amp

Provides sufficient current output for driving external components or devices, ensuring reliable signal transmission.

Receiver No. of Bits: 4

Supports data transmission with a particular bit resolution, suitable for applications requiring precise digital communication.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for easy and quick soldering during PCB assembly, streamlining manufacturing processes.

Peak Reflow Temperature °C: 250

Withstands high temperatures during soldering without compromising performance or reliability.

Length: 9.9 mm

Optimal length for integrating the component into circuit designs without excessive space consumption.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature ranges.

Maximum Receive Delay: 5 ns

Minimal delay in receiving signals, ensuring fast and accurate data transmission.

Terminal Form: GULL WING

Ideal for automated PCB assembly processes, improving efficiency and precision during production.

Maximum Supply Current: 40 mA

Efficient power consumption for maintaining safe operation, reducing overall energy requirements.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Provides noise immunity and signal conditioning, ensuring reliable and robust data transmission.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with common power sources, simplifying integration into existing systems.

Terminal Pitch: 1.27 mm

Optimal pitch spacing for easy and secure soldering, enhancing connectivity and signal integrity.

Moisture Sensitivity Level (MSL): 2

Suitable for applications with moderate exposure to moisture, ensuring long-term reliability in various environments.

Interface IC Type: LINE RECEIVER

Specifically designed for receiving and processing line signals with high accuracy and efficiency.

Technical Specifications

Line Drivers & Receivers TB5R2DE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

5 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TB5R2DE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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