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SNJ55LBC173W

Texas Instruments

SNJ55LBC173W by Texas Instruments

SNJ55LBC173W by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 5V. It features a max transmit delay of 35ns and operates in temperatures ranging from -55 to 125°C. Ideal for V.11, EIA-422-A, EIA-423-A, and EIA-485 interface standards applications.

Median Price

$68.930

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$68.930

1k+ parts

$61.680

10k+ parts

$58.050

4

-

$68.930

$61.680

$58.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,806 parts In-Stock

1+ parts

$63.270

100+ parts

-

1k+ parts

-

10k+ parts

-

3,806

$63.270

-

-

-

Vyrian

USA . 5,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,226

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,947 parts In-Stock

1+ parts

$6.207

100+ parts

-

1k+ parts

$6.969

10k+ parts

-

1,947

$6.207

-

$6.969

-

IDEA Electronic Components Group

UK . 2,085 parts In-Stock

1+ parts

$6.974

100+ parts

-

1k+ parts

$6.277

10k+ parts

-

2,085

$6.974

-

$6.277

-

ChromeModa Solutions

Germany . 1,768 parts In-Stock

1+ parts

$6.974

100+ parts

$5.719

1k+ parts

-

10k+ parts

-

1,768

$6.974

$5.719

-

-

AZTECH Wire

Italy . 901 parts In-Stock

1+ parts

$21.910

100+ parts

-

1k+ parts

-

10k+ parts

-

901

$21.910

-

-

-

Corphita

USA . 4,241 parts In-Stock

1+ parts

$59.940

100+ parts

-

1k+ parts

-

10k+ parts

-

4,241

$59.940

-

-

-

Microchip USA

USA . 1,382 parts In-Stock

1+ parts

$142.090

100+ parts

$139.620

1k+ parts

$138.390

10k+ parts

$137.150

1,382

$142.090

$139.620

$138.390

$137.150

DigiPath Technology Company

USA . 988 parts In-Stock

1+ parts

-

100+ parts

$6.288

1k+ parts

-

10k+ parts

-

988

-

$6.288

-

-

Overview

Experience top-notch quality and reliability with the SNJ55LBC173W by Texas Instruments, a leading manufacturer in the industry. This line driver and receiver offers unparalleled performance and versatility, making it perfect for a wide range of applications. With its advanced technology and robust construction, this product ensures seamless data transmission and exceptional efficiency. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Discover the value and benefits of the SNJ55LBC173W today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and protection for the internal components, ensuring reliable performance in various environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of systems and devices, making this product versatile and adaptable.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain stable performance even in elevated temperatures.

Interface Standard: V.11; EIA-422-A; EIA-423-A; EIA-485

Support for multiple interface standards ensures compatibility with a variety of communication protocols, making this product suitable for diverse applications.

Technical Specifications

Line Drivers & Receivers SNJ55LBC173W attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

V.11; EIA-422-A; EIA-423-A; EIA-485

JESD-30 Code:

R-CDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

16 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

35 ns

Receiver No. of Bits:

4

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

1.71 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

35 ns

Width:

6.73 mm

Trade Compliance

SNJ55LBC173W Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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