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SNJ54ACT1284W

Texas Instruments

SNJ54ACT1284W by Texas Instruments

SNJ54ACT1284W by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 5.5V max supply voltage and -55 to 125°C temperature range. It features IEEE-1284 interface standard, Schmitt trigger input characteristics, and MIL-PRF-38535 screening level. Ideal for military applications requiring fast signal transmission with minimal delay.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,920 parts In-Stock

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5,920

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Digiode

USA . 230 parts In-Stock

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230

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 987 parts In-Stock

1+ parts

$11.894

100+ parts

-

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$12.288

10k+ parts

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987

$11.894

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$12.288

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DigiPath Technology Company

USA . 2,152 parts In-Stock

1+ parts

$13.097

100+ parts

$12.049

1k+ parts

-

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2,152

$13.097

$12.049

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ChromeModa Solutions

Germany . 2,564 parts In-Stock

1+ parts

$13.364

100+ parts

$10.958

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2,564

$13.364

$10.958

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IDEA Electronic Components Group

UK . 1,234 parts In-Stock

1+ parts

$13.364

100+ parts

$12.696

1k+ parts

$12.028

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1,234

$13.364

$12.696

$12.028

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AZTECH Wire

Italy . 797 parts In-Stock

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$14.031

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797

$14.031

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One Stop Electronics

USA . 1,260 parts In-Stock

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$20.500

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$20.500

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Corphita

USA . 1,771 parts In-Stock

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Overview

Enhance your electronic designs with the Texas Instruments SNJ54ACT1284W line driver & receiver. Crafted with quality ceramic and metal-sealed materials, this product offers reliable performance in various applications. With its MIL-PRF-38535 screening level and military-grade temperature grade, customers can trust in the durability and precision of this device. Experience fast transmit and receive delays, along with multiple functions for efficient operation. Trust Texas Instruments for cutting-edge technology that delivers value and superior results in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

This high maximum supply voltage allows for stable and efficient operation.

Screening Level: MIL-PRF-38535

This MILITARY screening level indicates high quality and reliability of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand extreme heat conditions.

Interface Standard: IEEE-1284

Being compliant with the IEEE-1284 standard ensures compatibility with a wide range of devices.

Technical Specifications

Line Drivers & Receivers SNJ54ACT1284W attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

7

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE-1284

JESD-30 Code:

R-CDFP-F20

Length:

13.09 mm

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

4

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

20 ns

Width:

6.92 mm

Trade Compliance

SNJ54ACT1284W Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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