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SNJ55109AW

Texas Instruments

SNJ55109AW by Texas Instruments

SNJ55109AW by Texas Instruments is a Line Driver & Receiver with 14 terminals, offering constant-current output and differential output. It operates at temperatures ranging from -55 to 125°C, with a max transmit delay of 15 ns. Ideal for military applications requiring high-speed data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,615 parts In-Stock

1+ parts

-

100+ parts

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8,615

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-

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Digiode

USA . 2,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,649

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$5.509

100+ parts

-

1k+ parts

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-

375

$5.509

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-

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Parana Technologies

USA . 381 parts In-Stock

1+ parts

$8.377

100+ parts

-

1k+ parts

$9.006

10k+ parts

-

381

$8.377

-

$9.006

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DigiPath Technology Company

USA . 880 parts In-Stock

1+ parts

$9.224

100+ parts

-

1k+ parts

-

10k+ parts

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880

$9.224

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ChromeModa Solutions

Germany . 5,591 parts In-Stock

1+ parts

$9.412

100+ parts

$7.718

1k+ parts

-

10k+ parts

-

5,591

$9.412

$7.718

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IDEA Electronic Components Group

UK . 1,173 parts In-Stock

1+ parts

$9.412

100+ parts

$8.941

1k+ parts

$8.471

10k+ parts

-

1,173

$9.412

$8.941

$8.471

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One Stop Electronics

USA . 984 parts In-Stock

1+ parts

$25.500

100+ parts

-

1k+ parts

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10k+ parts

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984

$25.500

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Corphita

USA . 899 parts In-Stock

1+ parts

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899

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Overview

Elevate your electronic designs with the SNJ55109AW by Texas Instruments, a top-tier line driver & receiver that delivers superior quality and reliability. Manufactured with precision in mind, this product offers seamless integration for a wide range of applications. With a military-grade temperature rating and constant-current output characteristics, this device ensures optimal performance even in challenging environments. Experience the value and benefits of this innovative solution, providing customers with unmatched efficiency and functionality. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal stability and reliability, making the product suitable for harsh environments and ensuring long-lasting performance.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Transmit Delay: 15 ns

Low transmit delay ensures fast data transmission, making the product ideal for high-speed communication applications.

Power Supplies (V): +-5

Wide power supply range of +-5V allows for flexibility in integrating the product into various voltage systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in extreme heat conditions.

Differential Output: YES

Differential output helps in reducing noise and increasing signal integrity, making the product suitable for noise-sensitive applications.

Technology: BIPOLAR

Bipolar technology offers high speed and precision, making the product suitable for demanding signal processing tasks.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V makes the product compatible with most common voltage systems, ensuring easy integration.

Technical Specifications

Line Drivers & Receivers SNJ55109AW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00004 Amp

JESD-30 Code:

R-XDFP-F14

Nominal Negative Supply Voltage:

-5 V

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

CONSTANT-CURRENT

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

15 ns

Trade Compliance

SNJ55109AW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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