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SNJ55107BW

Texas Instruments

SNJ55107BW by Texas Instruments

SNJ55107BW by Texas Instruments is a MILITARY-grade Line Driver & Receiver with +-5V power supplies. It features 14 terminals, 25ns max receive delay, and operates b/w -55 to 125 °C. Ideal for applications requiring high-speed data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,172 parts In-Stock

1+ parts

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1k+ parts

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3,172

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-

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Digiode

USA . 579 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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579

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,476 parts In-Stock

1+ parts

$3.445

100+ parts

-

1k+ parts

$3.971

10k+ parts

-

1,476

$3.445

-

$3.971

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ChromeModa Solutions

Germany . 4,306 parts In-Stock

1+ parts

$3.871

100+ parts

$3.174

1k+ parts

-

10k+ parts

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4,306

$3.871

$3.174

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$3.871

100+ parts

-

1k+ parts

$3.484

10k+ parts

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1,433

$3.871

-

$3.484

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AZTECH Wire

Italy . 529 parts In-Stock

1+ parts

$13.718

100+ parts

-

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10k+ parts

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529

$13.718

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One Stop Electronics

USA . 134 parts In-Stock

1+ parts

$43.500

100+ parts

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134

$43.500

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Corphita

USA . 3,799 parts In-Stock

1+ parts

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100+ parts

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3,799

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DigiPath Technology Company

USA . 394 parts In-Stock

1+ parts

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100+ parts

$3.490

1k+ parts

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394

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$3.490

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Overview

Elevate your electronic design projects with the SNJ55107BW by Texas Instruments. As a leader in the industry, Texas Instruments delivers unmatched quality and precision in their line drivers and receivers. With a durable ceramic body and surface-mount capability, this product is versatile for various applications. The SNJ55107BW offers customers exceptional value with its high performance, reliability, and efficiency. Experience seamless integration and enhanced functionality with this top-of-the-line technology.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides good thermal conductivity and high mechanical strength, making the product durable and reliable in various operating conditions.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and improving assembly process.

Screening Level: 38535Q/M;38534H;883B

Compliance with multiple screening levels ensure the product meets high quality standards and performance requirements for different applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain performance reliability.

Technology: BIPOLAR

Bipolar technology offers fast switching speeds and low power consumption, making the product suitable for high-speed data transmission applications.

Technical Specifications

Line Drivers & Receivers SNJ55107BW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F14

Nominal Negative Supply Voltage:

-5 V

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Low Current:

16 Amp

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNJ55107BW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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