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SNJ55LBC173J

Texas Instruments

SNJ55LBC173J by Texas Instruments

SNJ55LBC173J by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at temperatures from -55 to 125 °C. It features a max supply voltage of 5.25 V and offers a max transmit delay of 35 ns. Ideal for applications requiring V.11, EIA-422-A, EIA-423-A, or EIA-485 interface standards.

Median Price

$61.010

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9 parts In-Stock

1+ parts

$61.010

100+ parts

-

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9

$61.010

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Verical

USA . 9 parts In-Stock

1+ parts

$61.010

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9

$61.010

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Rochester

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$59.940

1k+ parts

$53.630

10k+ parts

$50.470

7

-

$59.940

$53.630

$50.470

DigiKey

USA . 7 parts In-Stock

1+ parts

-

100+ parts

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7

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Distributors (In-Stock)

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Digiode

USA . 1,430 parts In-Stock

1+ parts

$55.024

100+ parts

-

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1,430

$55.024

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Vyrian

USA . 5,105 parts In-Stock

1+ parts

-

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5,105

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-

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

1+ parts

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10

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Bristol Electronics

USA . 10 parts In-Stock

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10

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Dan-Mar Components

USA . 10 parts In-Stock

1+ parts

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10

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Corel Iberica Componentes, S.L.

Spain . 5 parts In-Stock

1+ parts

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5

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ComSIT Distribution GmbH

Germany . 1 parts In-Stock

1+ parts

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$2.841

100+ parts

$2.585

1k+ parts

$2.330

10k+ parts

-

5,000

$2.841

$2.585

$2.330

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Parana Technologies

USA . 1,736 parts In-Stock

1+ parts

$11.200

100+ parts

-

1k+ parts

$11.639

10k+ parts

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1,736

$11.200

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$11.639

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DigiPath Technology Company

USA . 854 parts In-Stock

1+ parts

$12.332

100+ parts

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854

$12.332

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ChromeModa Solutions

Germany . 2,825 parts In-Stock

1+ parts

$12.584

100+ parts

$10.319

1k+ parts

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2,825

$12.584

$10.319

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IDEA Electronic Components Group

UK . 418 parts In-Stock

1+ parts

$12.584

100+ parts

$11.955

1k+ parts

$11.326

10k+ parts

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418

$12.584

$11.955

$11.326

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Corphita

USA . 2,258 parts In-Stock

1+ parts

$52.128

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2,258

$52.128

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Microchip USA

USA . 2,478 parts In-Stock

1+ parts

$123.560

100+ parts

$121.410

1k+ parts

$120.330

10k+ parts

$119.260

2,478

$123.560

$121.410

$120.330

$119.260

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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Assy Fe

Spain . 19 parts In-Stock

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Overview

Experience unmatched quality and reliability with the SNJ55LBC173J by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge Line Drivers & Receivers that are perfect for a wide range of applications. From industrial to automotive, this product offers exceptional value and benefits, ensuring seamless communication and performance. With advanced technology and top-notch features, choose Texas Instruments for superior products that exceed expectations every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides excellent durability and reliability for the product, making it suitable for harsh operating environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems and applications, offering flexibility in use.

No. of Functions: 4

The product offers multiple functions in a single package, providing cost-effectiveness and space-saving benefits.

Maximum Transmit Delay: 35 ns

The low maximum transmit delay ensures fast signal transmission, making the product ideal for high-speed communication applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to perform reliably in extreme temperature conditions, enhancing its versatility.

Interface Standard: V.11; EIA-422-A; EIA-423-A; EIA-485

Support for multiple interface standards increases the product's compatibility with various communication protocols and systems.

Technical Specifications

Line Drivers & Receivers SNJ55LBC173J attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

V.11; EIA-422-A; EIA-423-A; EIA-485

JESD-30 Code:

R-CDIP-T16

JESD-609 Code:

e0

Length:

20.57 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

16 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

35 ns

Receiver No. of Bits:

4

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

4.005 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

35 ns

Width:

7.62 mm

Trade Compliance

SNJ55LBC173J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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