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SNJ54S257W

Texas Instruments

SNJ54S257W by Texas Instruments

SNJ54S257W by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at a supply voltage of 5V. It features a propagation delay of 7.5ns and output characteristics in 3-STATE. Ideal for military-grade applications due to its MIL-PRF-38535 screening level and wide temperature range from -55°C to 125°C.

Median Price

$26.920

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 3,466 parts In-Stock

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$26.920

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$20.190

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$17.500

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Digiode

USA . 3,961 parts In-Stock

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Vyrian

USA . 2,563 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 900 parts In-Stock

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Resion

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Electronic Expediters

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Electro Mavin

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Q Components

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Distributors (Availability)

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AZTECH Wire

Italy . 472 parts In-Stock

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$10.064

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Parana Technologies

USA . 1,727 parts In-Stock

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$11.210

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$11.649

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DigiPath Technology Company

USA . 1,110 parts In-Stock

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$12.343

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ChromeModa Solutions

Germany . 6,199 parts In-Stock

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IDEA Electronic Components Group

UK . 1,388 parts In-Stock

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$11.965

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$11.336

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One Stop Electronics

USA . 1,136 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,543 parts In-Stock

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Microchip USA

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Corphita

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Overview

Enhance your electronic designs with the SNJ54S257W by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. This multiplexer & demultiplexer offers unparalleled performance and versatility, making it ideal for a wide range of applications. Whether you're working on military-grade projects or commercial electronics, this product provides exceptional value with its efficient operation and robust construction. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability for extended usage in various environments.

Propagation Delay At Nominal Supply: 7.5 ns

High-speed performance ensures efficient data transmission and processing.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort.

No. of Functions: 4

Multiplexes and demultiplexes signals from multiple sources efficiently.

Screening Level: MIL-PRF-38535

Meets military standards for reliability and performance in harsh conditions.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with most systems.

Load Capacitance (CL): 15 pF

Optimizes signal integrity and efficiency in various applications.

Output Characteristics: 3-STATE

Offers flexibility in output control, enhancing functionality and versatility.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for rugged environments.

Minimum Operating Temperature: -55 °C

Works reliably in extreme cold conditions, ensuring consistent performance.

Technical Specifications

Multiplexer & Demultiplexer SNJ54S257W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

93 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

SNJ54S257W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-044-5802, 5962010445802

NIIN

010445802

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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