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SNJ54S175J

Texas Instruments

SNJ54S175J by Texas Instruments

SNJ54S175J by Texas Instruments is a TTL latch with 4 bits, 25 ns propagation delay, and 5V supply voltage. It is MIL-PRF-38535 screened for military applications, featuring positive edge trigger type and complementary output polarity. Ideal for high-speed operations up to 75 MHz in harsh environments with temperature range of -55°C to 125°C.

Median Price

$26.010

Lifecycle Status

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Rochester

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$24.370

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DigiKey

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Verical

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Freelance Electronics

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NAC Semi

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American Microsemiconductor Inc.

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Bristol Electronics

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Digiode

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Vyrian

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Electronic Expediters

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Mil-Aero Solutions, Inc.

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Microfarads

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Odi Ramu Company

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Inland Empire Components Inc.

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MISTER SPROCKETS

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North Shore Components

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A2Z Electronics, Inc.

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Electronics Depot

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Manoshevitz Elec. Sales

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Semi Source

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LWI Electronics Inc

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Ashlea Components Ltd

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Corphita

USA . 4,859 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 337 parts In-Stock

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ChromeModa Solutions

Germany . 5,737 parts In-Stock

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IDEA Electronic Components Group

UK . 2,282 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Microchip USA

USA . 2,238 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Metaverse IC Inc.

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Overview

Enhance your electronic designs with the high-quality SNJ54S175J latch & flip-flop by Texas Instruments. With a MIL-PRF-38535 screening level and ceramic, glass-sealed package body material, this versatile component offers reliability and durability for a wide range of applications. Whether you're working on military-grade equipment or consumer electronics, this product's 4-bit capacity, fast propagation delay, and complementary output polarity deliver exceptional performance. Trust Texas Instruments to provide cutting-edge technology and unmatched value in every product, including the SNJ54S175J. Elevate your projects with this top-of-the-line component today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 25 ns

Fast propagation delay allows for quick response times in applications requiring rapid data processing.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Maximum Frequency At Nominal Supply: 75000000 Hz

High-frequency capability allows for efficient operation in applications requiring fast signal processing.

Technology: TTL

Utilizes Transistor-Transistor Logic technology for reliable and robust performance in digital circuits.

Technical Specifications

Latches & Flip-Flops SNJ54S175J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

20 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

96 mA

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

75 MHz

Trade Compliance

SNJ54S175J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-095-8592, 5962010958592, 5962-01-249-0804, 5962012490804

NIIN

010958592, 012490804

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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