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SNJ54S139J

Texas Instruments

SNJ54S139J by Texas Instruments

SNJ54S139J by Texas Instruments is a TTL decoder with 2 functions, 12 ns propagation delay, and inverted output polarity. It operates in military-grade temperatures from -55 to 125 °C and has a max supply voltage of 5.5 V. Ideal for applications requiring fast signal decoding in harsh environments.

Median Price

$21.900

Lifecycle Status

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Chip1Stop

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Vyrian

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Digiode

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Manoshevitz Elec. Sales

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AZTECH Wire

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 5,631 parts In-Stock

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IDEA Electronic Components Group

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Overview

Enhance your electronic projects with the high-quality SNJ54S139J decoder & driver by Texas Instruments. With over 60 years of experience in the industry, Texas Instruments is known for delivering reliable and innovative solutions. This versatile component is ideal for a wide range of applications, providing fast propagation delay and inverted output polarity. Trust in Texas Instruments to provide you with top-notch performance and value, making your projects stand out from the rest. Choose the SNJ54S139J for your next design and experience the benefits of superior quality and precision engineering.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability to the product, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures faster signal processing and improved performance.

Input Conditioning: STANDARD

Standard input conditioning makes it compatible with a wide range of systems and applications.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Screening Level: MIL-PRF-38535

Military screening level ensures high reliability and performance in demanding environments.

Nominal Supply Voltage / Vsup (V): 5

Common supply voltage of 5V makes it compatible with standard power sources.

Load Capacitance (CL): 15 pF

Low load capacitance minimizes signal distortion and improves signal integrity.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and circuits.

Maximum I (ol): 20 Amp

High output current capability allows driving of heavy loads without external amplification.

Minimum Operating Temperature: -55 °C

Wide operating temperature range makes it suitable for use in extreme conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in hot environments.

Technology: TTL

TTL technology provides fast switching speeds and compatibility with a wide range of systems.

Technical Specifications

Decoder & Drivers SNJ54S139J attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

SCHOTTKY CLAMPED FOR HIGH PERFORMANCE

Family:

S

Input Conditioning:

STANDARD

JESD-30 Code:

R-CDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

74 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54S139J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-087-2320, 5962010872320, 5962-01-101-2408, 5962011012408, 5962-01-134-1691, 5962011341691, 5962-01-143-3852, 5962011433852, 5962-14-463-3806, 5962144633806

NIIN

010872320, 011012408, 011341691, 011433852, 144633806

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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