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SNJ54LS279AJ

Texas Instruments

SNJ54LS279AJ by Texas Instruments

SNJ54LS279AJ by Texas Instruments is a TTL latch with 4 functions, 2 bits, and 16 terminals. It has a propagation delay of 22 ns at 5V supply voltage. Ideal for military applications due to MIL-PRF-38535 screening level and low trigger type.

Median Price

$7.185

Lifecycle Status

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1k+

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Freelance Electronics

USA . 26 parts In-Stock

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Component Electronics Inc.

Canada . 2 parts In-Stock

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Digiode

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PC Components Company LLC

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

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First Choice Components Inc.

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Corel Iberica Componentes, S.L.

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Electro Mavin

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Mil-Aero Solutions, Inc.

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Odi Ramu Company

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AZTECH Wire

Italy . 822 parts In-Stock

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Parana Technologies

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IDEA Electronic Components Group

UK . 1,721 parts In-Stock

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ChromeModa Solutions

Germany . 518 parts In-Stock

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One Stop Electronics

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DigiPath Technology Company

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Computer Components Inc. - USA

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the SNJ54LS279AJ latches & flip-flops. This military-grade component offers fast propagation delay, low power consumption, and high noise immunity, making it ideal for demanding applications in harsh environments. Trust in Texas Instruments to deliver superior performance and durability, ensuring that your designs meet the highest standards of excellence. Upgrade your projects today with the SNJ54LS279AJ and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 22 ns

Fast propagation delay ensures quick response times in signal processing applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard and commonly available voltage, making it easy to integrate into existing systems.

No. of Bits: 2

Offers multiple functions in a compact design, allowing for efficient use of board space.

Trigger Type: LOW LEVEL

Provides flexibility in triggering the latch, allowing for customization of the device's behavior.

Technology: TTL

Utilizes TTL technology known for its reliability and compatibility with a wide range of systems.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold environments, making it suitable for diverse applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without sacrificing performance, ensuring reliable operation in harsh conditions.

Technical Specifications

Latches & Flip-Flops SNJ54LS279AJ attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

WITH DUAL S INPUT FOR TWO FUNCTIONS

Family:

LS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

7 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

7.62 mm

Trade Compliance

SNJ54LS279AJ Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-015-5991, 5962010155991, 5962-01-271-8226, 5962012718226

NIIN

010155991, 012718226

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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