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SNJ54HC273J

Texas Instruments

SNJ54HC273J by Texas Instruments

SNJ54HC273J by Texas Instruments is an 8-bit latches & flip-flops IC with a propagation delay of 48ns. Operating b/w -55 to 125°C, it has a max frequency of 18MHz and operates on a supply voltage range of 2-6V. Ideal for military-grade applications requiring fast data storage and retrieval.

Median Price

$10.983

Lifecycle Status

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32

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1k+

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Rochester

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Chip1Stop

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Digiode

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NAC Semi

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Manoshevitz Elec. Sales

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Inland Empire Components Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Component Sense

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Mil-Aero Solutions, Inc.

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PAR Electronics

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Ampacity Inc.

Singapore . 66 parts In-Stock

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Corphita

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Parana Technologies

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AZTECH Wire

Italy . 868 parts In-Stock

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IDEA Electronic Components Group

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ChromeModa Solutions

Germany . 363 parts In-Stock

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DigiPath Technology Company

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Overview

Upgrade your electronic projects with the SNJ54HC273J by Texas Instruments. Manufactured to the highest quality standards, this latches & flip-flops category product offers reliable performance and durability. Perfect for military-grade applications, this component provides a fast propagation delay and low power consumption. With a wide operating temperature range, this versatile device is ideal for a variety of projects. Trust Texas Instruments for unmatched value and innovation in every product they offer.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and protection for the latch, making it suitable for use in harsh environments.

Propagation Delay At Nominal Supply: 48 ns

The low propagation delay ensures fast response times, making this latch ideal for applications requiring quick switching.

Screening Level: MIL-PRF-38535

Compliance with MIL-PRF-38535 ensures high reliability and quality standards, making this latch suitable for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides a stable power source for the latch to operate efficiently.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch can withstand elevated temperature conditions without compromising performance.

Technical Specifications

Latches & Flip-Flops SNJ54HC273J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

HC/UH

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

18000000 Hz

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

48 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

21 MHz

Trade Compliance

SNJ54HC273J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-235-3495, 5962012353495, 5962-01-340-9339, 5962013409339, 5962-01-250-4384, 5962012504384, 5962-01-367-6022, 5962013676022

NIIN

012353495, 013409339, 012504384, 013676022

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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