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SNJ54AS175BJ

Texas Instruments

SNJ54AS175BJ by Texas Instruments

SNJ54AS175BJ by Texas Instruments is a 4-bit latch with 11 ns propagation delay, suitable for military applications. It operates at a supply voltage of 5V and has a max frequency of 100 MHz. With MIL-PRF-38535 screening, this TTL technology flip-flop offers fast response times in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,570 parts In-Stock

1+ parts

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3,570

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Digiode

USA . 1,658 parts In-Stock

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1,658

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,115 parts In-Stock

1+ parts

$12.703

100+ parts

-

1k+ parts

$13.172

10k+ parts

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1,115

$12.703

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$13.172

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ChromeModa Solutions

Germany . 4,830 parts In-Stock

1+ parts

$14.273

100+ parts

$11.704

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4,830

$14.273

$11.704

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IDEA Electronic Components Group

UK . 1,917 parts In-Stock

1+ parts

$14.273

100+ parts

$13.559

1k+ parts

$12.846

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1,917

$14.273

$13.559

$12.846

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AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$19.345

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894

$19.345

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One Stop Electronics

USA . 1,316 parts In-Stock

1+ parts

$41.000

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1,316

$41.000

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Microchip USA

USA . 12,462 parts In-Stock

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12,462

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Corphita

USA . 2,100 parts In-Stock

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2,100

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DigiPath Technology Company

USA . 1,431 parts In-Stock

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$12.869

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1,431

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$12.869

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Overview

Unlock endless possibilities with the SNJ54AS175BJ by Texas Instruments! Crafted with precision and expertise, this latches & flip-flops category component offers unparalleled quality and reliability. Suitable for a wide range of applications, this product guarantees efficient performance and seamless operation. Experience the value and benefits of this cutting-edge technology, providing you with the advantage you need to stay ahead in today's fast-paced world. Choose Texas Instruments for superior products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, making the latch reliable for long-term use in various environments.

Propagation Delay At Nominal Supply: 11 ns

The fast propagation delay allows for quick response times, making this latch suitable for applications requiring rapid signal processing.

No. of Bits: 4

With 4 bits, this latch can store a moderate amount of data, making it suitable for applications that require basic memory functionality.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common voltage of 5V allows for easy integration into existing circuits and power supplies.

Maximum Seated Height: 5.08 mm

The compact size of this latch saves space on a circuit board, making it ideal for applications with limited area for components.

Technology: TTL

TTL technology offers reliable and simple operation, making this latch a trusted choice for various electronic systems.

Technical Specifications

Latches & Flip-Flops SNJ54AS175BJ attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

20 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

34 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Minimum fmax:

100 MHz

Trade Compliance

SNJ54AS175BJ Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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