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SNJ5407FK

Texas Instruments

SNJ5407FK by Texas Instruments

SNJ5407FK by Texas Instruments is a TTL logic gate with 6 functions, 30ns propagation delay at 5V. It has open-collector output and operates in military-grade temperature range. Ideal for applications requiring fast signal processing in harsh environments.

Median Price

$23.260

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$23.260

100+ parts

$21.870

1k+ parts

$19.780

10k+ parts

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3

$23.260

$21.870

$19.780

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Distributors (In-Stock)

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Digiode

USA . 781 parts In-Stock

1+ parts

$22.097

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781

$22.097

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Vyrian

USA . 3,135 parts In-Stock

1+ parts

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3,135

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Chip Stock

USA . 2,548 parts In-Stock

1+ parts

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North Shore Components

USA . 2 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Electronics Depot

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 371 parts In-Stock

1+ parts

$7.735

100+ parts

-

1k+ parts

$8.270

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371

$7.735

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$8.270

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DigiPath Technology Company

USA . 706 parts In-Stock

1+ parts

$8.517

100+ parts

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706

$8.517

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ChromeModa Solutions

Germany . 5,901 parts In-Stock

1+ parts

$8.691

100+ parts

$7.127

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5,901

$8.691

$7.127

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IDEA Electronic Components Group

UK . 1,141 parts In-Stock

1+ parts

$8.691

100+ parts

$8.256

1k+ parts

$7.822

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1,141

$8.691

$8.256

$7.822

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AZTECH Wire

Italy . 1,206 parts In-Stock

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$9.140

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$9.140

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Corphita

USA . 1,292 parts In-Stock

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$20.934

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$20.934

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Component Stockers USA

USA . 2 parts In-Stock

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$22.930

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$22.930

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$29.109

100+ parts

$26.489

1k+ parts

$23.869

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500

$29.109

$26.489

$23.869

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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QUARKTWIN TECHNOLOGY LTD

USA . 3,455 parts In-Stock

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3,455

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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Microchip USA

USA . 986 parts In-Stock

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986

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Overview

Unlock the power of efficient logic gates with the Texas Instruments SNJ5407FK. Known for their high-quality manufacturing, Texas Instruments delivers reliable products that exceed industry standards. Ideal for military-grade applications, this chip carrier package offers fast propagation delay and open-collector output characteristics. With a nominal supply voltage of 5V and low power consumption, the SNJ5407FK provides exceptional value and performance for your electronic projects. Upgrade to Texas Instruments for unmatched reliability and precision in logic gates.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 30 ns

Fast propagation delay ensures quick response time, making it ideal for high-speed applications.

Surface Mount: YES

Easy installation and compact size due to surface mount capability.

No. of Functions: 6

Multiple functions in one package offer versatility and cost-effectiveness.

Screening Level: MIL-PRF-38535

Meets military standards for reliability and performance.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with common power sources.

Load Capacitance (CL): 50 pF

Suitable for driving capacitive loads without performance degradation.

Power Supplies (V): 5

Operates efficiently at a standard voltage.

No. of Terminals: 20

Sufficient terminals for connecting to other components and circuits.

Package Style (Meter): CHIP CARRIER

Compact chip carrier package saves space and simplifies PCB layout.

Maximum I (ol): 30 Amp

High output current capability for driving loads.

Output Characteristics: OPEN-COLLECTOR

Suitable for interfacing with various logic families and external devices.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold environments without performance issues.

Temperature Grade: MILITARY

Designed to withstand harsh military environments and conditions.

Technology: TTL

Uses popular TTL technology known for its speed and reliability.

Maximum Power Supply Current (ICC): 41 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Logic Gates SNJ5407FK attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

30 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

41 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ5407FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-306-9211, 5962013069211

NIIN

013069211

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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