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SN74LVTH273DWRE4

Texas Instruments

SN74LVTH273DWRE4 by Texas Instruments

SN74LVTH273DWRE4 by Texas Instruments is an 8-bit latch with a propagation delay of 4.9 ns and operates at a supply voltage of 3.3V. It features positive edge triggering, BICMOS technology, and can handle a max frequency of 150 MHz. Ideal for industrial applications requiring fast data transfer in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,647 parts In-Stock

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Digiode

USA . 1,493 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 386 parts In-Stock

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$8.122

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Parana Technologies

USA . 569 parts In-Stock

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$27.566

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$37.372

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569

$27.566

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DigiPath Technology Company

USA . 1,330 parts In-Stock

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$30.354

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$27.925

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$30.354

$27.925

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ChromeModa Solutions

Germany . 1,929 parts In-Stock

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$30.973

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$25.398

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$30.973

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IDEA Electronic Components Group

UK . 629 parts In-Stock

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$30.973

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$29.424

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$27.876

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629

$30.973

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$27.876

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One Stop Electronics

USA . 716 parts In-Stock

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$32.000

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Corphita

USA . 3,094 parts In-Stock

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Kepictronics

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Microchip USA

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Overview

Elevate your electronics projects with the SN74LVTH273DWRE4 by Texas Instruments. This high-quality latch & flip-flop component boasts reliable performance and durability, thanks to Texas Instruments' renowned reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this product offers customers value and benefits with its speedy propagation delay and low power consumption. Upgrade your designs with the SN74LVTH273DWRE4 and experience the advantage of top-tier technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability to the product.

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast operation of the latch or flip-flop.

Surface Mount: YES

Surface mount capability makes it easy to integrate into PCBs for compact design.

No. of Bits: 8

8-bit configuration allows for multiple data inputs and outputs.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage of 3.3V ensures proper functionality of the latch or flip-flop.

Load Capacitance (CL): 50 pF

Low load capacitance enables efficient signal transmission.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures enhances the product's versatility.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and design.

Maximum Seated Height: 2.65 mm

Low seated height enables space-saving installation.

Maximum Frequency At Nominal Supply: 150000000 Hz

High operating frequency allows for rapid data processing.

Technology: BICMOS

BICMOS technology offers a balance of high speed and low power consumption.

Maximum Power Supply Current (ICC): 5 mA

Low power supply current requirement helps in energy efficiency.

Technical Specifications

Latches & Flip-Flops SN74LVTH273DWRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

150 MHz

Trade Compliance

SN74LVTH273DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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