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SN74LVC74ADG4

Texas Instruments

SN74LVC74ADG4 by Texas Instruments

SN74LVC74ADG4 by Texas Instruments is a dual-function latches & flip-flops IC with 5.2 ns propagation delay at 1.8V, suitable for automotive applications. It operates at a max frequency of 150MHz, has a supply voltage range of 1.65V to 3.6V, and features positive edge trigger type for fast data processing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 41,500 parts In-Stock

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Digiode

USA . 3,386 parts In-Stock

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Vyrian

USA . 2,465 parts In-Stock

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AZTECH Wire

Italy . 824 parts In-Stock

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$12.379

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Parana Technologies

USA . 872 parts In-Stock

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$18.850

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$18.929

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872

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$18.929

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DigiPath Technology Company

USA . 88 parts In-Stock

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$20.756

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88

$20.756

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ChromeModa Solutions

Germany . 4,595 parts In-Stock

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$21.180

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$17.368

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$21.180

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IDEA Electronic Components Group

UK . 1,427 parts In-Stock

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$21.180

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$20.121

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$19.062

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One Stop Electronics

USA . 597 parts In-Stock

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$36.000

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QUARKTWIN TECHNOLOGY LTD

USA . 23,705 parts In-Stock

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Corphita

USA . 4,504 parts In-Stock

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Microchip USA

USA . 4,135 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic projects with the SN74LVC74ADG4 by Texas Instruments, a top-quality latches & flip-flops component with dual functions that guarantee seamless performance. Designed to operate in extreme temperatures and suitable for automotive use, this small outline package offers fast propagation delay and low power consumption. With a wide supply voltage range and high frequency capability, this versatile product ensures reliability and efficiency in various applications. Trust Texas Instruments for cutting-edge technology that delivers value and innovation to meet all your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Propagation Delay At Nominal Supply: 5.2 ns

Fast operation ensures quick response times in circuit applications.

Surface Mount: YES

Ease of installation and space-saving design.

No. of Functions: 2

Can perform multiple functions, making it versatile in circuit designs.

Nominal Supply Voltage / Vsup: 1.8 V

Operates at a low voltage, suitable for energy-efficient applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and automotive environments.

Trigger Type: POSITIVE EDGE

Allows for precise timing control in circuit operations.

Technology: CMOS

Utilizes low power consumption and high noise immunity, ideal for various digital applications.

Terminal Form: GULL WING

Easy to solder and provides reliable electrical connections.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability in harsh environments.

Technical Specifications

Latches & Flip-Flops SN74LVC74ADG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

150 MHz

Trade Compliance

SN74LVC74ADG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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