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SN74LVC157AQDREP

Texas Instruments

SN74LVC157AQDREP by Texas Instruments

SN74LVC157AQDREP by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 5.4 ns at 3.3V supply voltage. It operates in the temperature range of -40 to 125°C and is suitable for automotive applications due to its small outline package style and nickel palladium gold terminal finish.

Median Price

$1.799

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 69,092 parts In-Stock

1+ parts

$1.799

100+ parts

$1.486

1k+ parts

$0.803

10k+ parts

-

69,092

$1.799

$1.486

$0.803

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 308 parts In-Stock

1+ parts

$1.709

100+ parts

-

1k+ parts

-

10k+ parts

-

308

$1.709

-

-

-

Vyrian

USA . 6,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,784

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,088 parts In-Stock

1+ parts

$1.619

100+ parts

-

1k+ parts

-

10k+ parts

-

1,088

$1.619

-

-

-

AZTECH Wire

Italy . 919 parts In-Stock

1+ parts

$13.880

100+ parts

-

1k+ parts

-

10k+ parts

-

919

$13.880

-

-

-

Parana Technologies

USA . 447 parts In-Stock

1+ parts

$23.783

100+ parts

-

1k+ parts

$24.414

10k+ parts

-

447

$23.783

-

$24.414

-

DigiPath Technology Company

USA . 1,472 parts In-Stock

1+ parts

$26.189

100+ parts

$24.093

1k+ parts

-

10k+ parts

-

1,472

$26.189

$24.093

-

-

ChromeModa Solutions

Germany . 6,676 parts In-Stock

1+ parts

$26.723

100+ parts

$21.913

1k+ parts

-

10k+ parts

-

6,676

$26.723

$21.913

-

-

IDEA Electronic Components Group

UK . 327 parts In-Stock

1+ parts

$26.723

100+ parts

$25.387

1k+ parts

$24.051

10k+ parts

-

327

$26.723

$25.387

$24.051

-

Overview

Unlock the power of seamless data transmission with the SN74LVC157AQDREP by Texas Instruments. Crafted with precision and expertise, this multiplexer & demultiplexer boasts unparalleled quality and reliability. Perfect for a wide range of applications, this versatile component offers customers unmatched value and performance. Say goodbye to inefficiencies and hello to peak efficiency with the SN74LVC157AQDREP - your gateway to superior functionality and innovation. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 5.4 ns

Low propagation delay ensures fast processing speed, making the product efficient.

Surface Mount: YES

Surface mount capability ensures easy installation and saves space on the PCB.

No. of Functions: 4

Having 4 functions in one device increases flexibility and functionality in circuit design.

No. of Inputs: 2

2 inputs allow for multiple signal inputs to be processed effectively.

Package Shape: RECTANGULAR

Rectangular shape makes the package easy to handle and integrate into existing systems.

No. of Bits: 2

2 bits provide sufficient capacity for data processing and manipulation.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal supply voltage ensures stable and reliable operation of the device.

Load Capacitance (CL): 50 pF

Low load capacitance ensures efficient signal transmission and processing.

Power Supplies (V): 3.3

Operating at 3.3V provides standard power compatibility in various systems.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact designs.

Maximum I (ol): 24 Amp

High maximum output current allows for handling of large loads efficiently.

Propagation Delay (tpd): 6.2 ns

Low propagation delay ensures fast processing speed, improving overall performance.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes the product suitable for various environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable operation in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for easy and secure attachment to the PCB.

Maximum Seated Height: 1.75 mm

Low seated height saves space on the PCB and facilitates compact designs.

Width: 3.9 mm

Compact width allows for efficient use of space on the PCB.

Output Polarity: TRUE

True output polarity ensures correct signal processing and reliable operation.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage enables operation in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable soldering and component longevity.

Length: 9.9 mm

Compact length allows for efficient use of space on the PCB.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in automotive applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form enables easy and secure surface mounting on the PCB.

Packing Method: TR

TR packing method ensures secure and organized packaging for transportation and storage.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm provides standard spacing for easy PCB integration.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage allows for operation in systems with higher voltage requirements.

Maximum Power Supply Current (ICC): 0.01 mA

Low maximum power supply current ensures efficient power usage and minimal heat generation.

Technical Specifications

Multiplexer & Demultiplexer SN74LVC157AQDREP attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LVC157AQDREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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