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SN74HC257DG4

Texas Instruments

SN74HC257DG4 by Texas Instruments

SN74HC257DG4 by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 25ns. Operating at a supply voltage of 5V, it features a max power supply current of 0.08mA and is ideal for industrial applications requiring CMOS technology in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,892 parts In-Stock

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Digiode

USA . 2,392 parts In-Stock

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Connector Distribution Corp

USA . 859 parts In-Stock

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Right Parts Inc.

USA . 859 parts In-Stock

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Cyclops Electronics Ltd

UK . 300 parts In-Stock

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One Stop Electronics

USA . 720 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 198 parts In-Stock

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$15.641

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Parana Technologies

USA . 970 parts In-Stock

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$17.468

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$17.663

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DigiPath Technology Company

USA . 1,925 parts In-Stock

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$19.234

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$17.696

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$19.234

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ChromeModa Solutions

Germany . 1,808 parts In-Stock

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$19.627

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$16.094

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IDEA Electronic Components Group

UK . 1,660 parts In-Stock

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$19.627

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$18.646

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$17.664

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Corphita

USA . 4,666 parts In-Stock

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Microchip USA

USA . 2,390 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic projects with the high-quality and reliable SN74HC257DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch multiplexer & demultiplexer components that guarantee optimal performance. Ideal for applications requiring efficient data routing, this product offers customers value through its precision design, fast propagation delay, and versatile functionality. Upgrade your circuit designs with the SN74HC257DG4 and experience the benefits of seamless operation and enhanced productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 25 ns

Low propagation delay ensures fast data transfer, making this multiplexer/demultiplexer ideal for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions: 4

With 4 functions in one device, this multiplexer/demultiplexer offers versatility and flexibility in data routing and selection.

No. of Inputs: 2

2 inputs provide sufficient options for data input, making the device suitable for various applications with different input requirements.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, optimizing design layout and saving valuable board real estate.

No. of Bits: 2

2-bit capability enables selection among 4 different data channels, providing flexibility and scalability in data routing scenarios.

Technical Specifications

Multiplexer & Demultiplexer SN74HC257DG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC257DG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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