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SN74HC151QDRG4Q1

Texas Instruments

SN74HC151QDRG4Q1 by Texas Instruments

Texas Instruments SN74HC151QDRG4Q1 is an 8-input multiplexer with a propagation delay of 73ns at 5V. It operates in industrial temperatures (-40 to 85°C) and has a max supply voltage of 6V. Ideal for applications requiring high-speed data selection in automotive electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,591 parts In-Stock

1+ parts

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7,591

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Chip Stock

USA . 3,977 parts In-Stock

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3,977

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Digiode

USA . 2,589 parts In-Stock

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2,589

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Distributors (Availability)

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$13.809

100+ parts

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460

$13.809

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Parana Technologies

USA . 2,221 parts In-Stock

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$27.238

100+ parts

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$33.588

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2,221

$27.238

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$33.588

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ChromeModa Solutions

Germany . 3,818 parts In-Stock

1+ parts

$30.604

100+ parts

$25.095

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3,818

$30.604

$25.095

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IDEA Electronic Components Group

UK . 990 parts In-Stock

1+ parts

$30.604

100+ parts

$29.074

1k+ parts

$27.544

10k+ parts

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990

$30.604

$29.074

$27.544

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One Stop Electronics

USA . 1,076 parts In-Stock

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$33.000

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1,076

$33.000

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Microchip USA

USA . 2,483 parts In-Stock

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2,483

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DigiPath Technology Company

USA . 2,122 parts In-Stock

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$27.593

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2,122

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$27.593

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Corphita

USA . 1,474 parts In-Stock

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1,474

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Overview

Enhance your electronic projects with the SN74HC151QDRG4Q1 by Texas Instruments, a top-notch multiplexer & demultiplexer that offers unparalleled quality and reliability. With a wide range of applications in various industries, this product provides seamless functionality and exceptional performance. Trust in Texas Instruments' expertise to deliver innovative solutions that exceed expectations. Upgrade your systems with the SN74HC151QDRG4Q1 and experience the value, benefits, and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product, making it suitable for various applications.

Propagation Delay At Nominal Supply: 73 ns

Low propagation delay ensures fast signal processing, making this product efficient for high-speed data transmission.

No. of Inputs: 8

Having 8 inputs allows for versatile connectivity options, making it suitable for complex signal routing requirements.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V offers compatibility with standard electronic systems, making integration easier.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliability in various settings.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Multiplexer & Demultiplexer SN74HC151QDRG4Q1 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

73 ns

Propagation Delay (tpd):

345 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74HC151QDRG4Q1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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