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SN74AUP1G80DBVTG4

Texas Instruments

SN74AUP1G80DBVTG4 by Texas Instruments

SN74AUP1G80DBVTG4 by Texas Instruments is a CMOS latch with 28.7 ns propagation delay, 30 pF load capacitance, and 260 MHz max frequency. It operates at a supply voltage of 1.2/3.3 V and is ideal for industrial applications requiring positive edge triggering in a small outline package.

Median Price

$1.406

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,499 parts In-Stock

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Digiode

USA . 4,325 parts In-Stock

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Bristol Electronics

USA . 195 parts In-Stock

1+ parts

-

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$1.406

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$0.844

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195

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$1.406

$0.844

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Microfarads

USA . 188 parts In-Stock

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188

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 569 parts In-Stock

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$6.620

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569

$6.620

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Parana Technologies

USA . 1,702 parts In-Stock

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$24.712

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$25.378

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1,702

$24.712

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DigiPath Technology Company

USA . 384 parts In-Stock

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$27.211

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$25.034

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384

$27.211

$25.034

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IDEA Electronic Components Group

UK . 2,131 parts In-Stock

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$27.766

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$26.378

1k+ parts

$24.989

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2,131

$27.766

$26.378

$24.989

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ChromeModa Solutions

Germany . 1,325 parts In-Stock

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$27.766

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$22.768

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$27.766

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Ampacity Inc.

Singapore . 557 parts In-Stock

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$40.000

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One Stop Electronics

USA . 1,403 parts In-Stock

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Microchip USA

USA . 2,379 parts In-Stock

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Aranea Global

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Enhance your electronic projects with the SN74AUP1G80DBVTG4 by Texas Instruments, a top-quality latch and flip-flop component. Known for their reliability and innovation, Texas Instruments delivers products that exceed industry standards. This versatile component is perfect for a wide range of applications, offering customers unmatched value and performance. Upgrade your designs today with the SN74AUP1G80DBVTG4 and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to external factors, making the product suitable for various operating conditions.

Propagation Delay At Nominal Supply: 28.7 ns

Low propagation delay ensures fast response times, making the latch or flip-flop efficient for time-critical applications.

Surface Mount: YES

Surface mount capability enables easy and secure installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low supply voltage, making it energy-efficient and suitable for battery-powered devices.

Load Capacitance (CL): 30 pF

Designed to work effectively with standard load capacitances, ensuring compatibility with a wide range of circuit configurations.

Power Supplies (V): 1.2/3.3

Supports multiple power supply options, allowing flexibility in design and compatibility with different voltage sources.

No. of Terminals: 5

Simple interface with a limited number of terminals, making it easy to integrate into circuit designs and reducing complexity.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, facilitating bus sharing and reducing power consumption in multi-device systems.

Trigger Type: POSITIVE EDGE

Positive edge triggering enables precise control over the latch or flip-flop operation, ensuring accurate timing in data processing.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows reliable performance in various environmental conditions, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation, making the product efficient and reliable.

Technical Specifications

Latches & Flip-Flops SN74AUP1G80DBVTG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

260000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Maximum Power Supply Current (ICC):

.0009 mA

Propagation Delay At Nominal Supply:

28.7 ns

Propagation Delay (tpd):

28.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

1.6 mm

Minimum fmax:

260 MHz

Trade Compliance

SN74AUP1G80DBVTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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