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SN74AUP1G80DBVRG4

Texas Instruments

SN74AUP1G80DBVRG4 by Texas Instruments

SN74AUP1G80DBVRG4 by Texas Instruments is a CMOS latch with 28.7 ns propagation delay, 30 pF load capacitance, and 260 MHz max frequency. It operates at a supply voltage of 1.2V/3.3V and is ideal for industrial applications requiring positive edge triggering in a small outline package.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 4,450 parts In-Stock

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Vyrian

USA . 2,710 parts In-Stock

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2,710

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Distributors (Availability)

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AZTECH Wire

Italy . 324 parts In-Stock

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$15.854

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Parana Technologies

USA . 1,931 parts In-Stock

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$18.183

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$18.321

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DigiPath Technology Company

USA . 1,180 parts In-Stock

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$20.021

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ChromeModa Solutions

Germany . 1,606 parts In-Stock

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$20.430

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$16.753

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IDEA Electronic Components Group

UK . 200 parts In-Stock

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$20.430

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$19.408

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$18.387

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One Stop Electronics

USA . 201 parts In-Stock

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$25.000

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Microchip USA

USA . 2,097 parts In-Stock

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Corphita

USA . 1,760 parts In-Stock

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Overview

Experience the reliability and innovation of Texas Instruments with the SN74AUP1G80DBVRG4 latches & flip-flops. This high-quality product offers seamless operation, fast response times, and versatile applications across various industries. With a focus on efficiency and performance, Texas Instruments delivers a cutting-edge solution that ensures precision and stability in your projects. Elevate your designs with the unmatched value and benefits of the SN74AUP1G80DBVRG4, setting new standards for excellence in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 28.7 ns

The low propagation delay ensures fast and efficient operation, making this latch suitable for time-sensitive applications.

Surface Mount: YES

Being surface mountable makes installation and assembly easier, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy integration into various electronic systems.

Nominal Supply Voltage / Vsup (V): 1.2

The low nominal supply voltage makes this latch energy-efficient and suitable for battery-powered devices.

Load Capacitance (CL): 30 pF

The low load capacitance ensures minimal interference and signal distortion, maintaining signal integrity.

Power Supplies (V): 1.2/3.3

Compatibility with multiple power supplies offers flexibility in usage and integration with different systems.

No. of Terminals: 5

The sufficient number of terminals allows for versatile connectivity options and integration with other electronic components.

Maximum I (ol): 4 Amp

The high maximum output current capacity ensures the latch can handle heavy loads and provide reliable performance under high current conditions.

Output Characteristics: 3-STATE

The 3-state output allows for multiple output states, providing more control and versatility in signal routing and processing.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing and control over the latch operation, making it suitable for synchronous applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating means the latch can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Technical Specifications

Latches & Flip-Flops SN74AUP1G80DBVRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

260000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Maximum Power Supply Current (ICC):

.0009 mA

Propagation Delay At Nominal Supply:

28.7 ns

Propagation Delay (tpd):

28.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

1.6 mm

Minimum fmax:

260 MHz

Trade Compliance

SN74AUP1G80DBVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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