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SN74AUC1G79DCKRG4

Texas Instruments

SN74AUC1G79DCKRG4 by Texas Instruments

SN74AUC1G79DCKRG4 by Texas Instruments is a latches & flip-flops IC with 3.9 ns propagation delay, operating at 1.2V. It features a small outline package, 5 terminals, and can handle up to 9 Amps output current. Ideal for applications requiring positive edge triggering and true output polarity in industrial settings with temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,289 parts In-Stock

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Digiode

USA . 2,283 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,348 parts In-Stock

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Bristol Electronics

USA . 1,348 parts In-Stock

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Dan-Mar Components

USA . 1,348 parts In-Stock

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AZTECH Wire

Italy . 433 parts In-Stock

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$10.038

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One Stop Electronics

USA . 1,472 parts In-Stock

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$18.000

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Parana Technologies

USA . 410 parts In-Stock

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$28.879

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$52.859

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DigiPath Technology Company

USA . 164 parts In-Stock

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$31.799

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ChromeModa Solutions

Germany . 3,497 parts In-Stock

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$32.448

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$26.607

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IDEA Electronic Components Group

UK . 64 parts In-Stock

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$32.448

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$30.826

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$29.203

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QUARKTWIN TECHNOLOGY LTD

USA . 29,196 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unlock the potential of your electronic projects with the SN74AUC1G79DCKRG4 by Texas Instruments. Crafted with precision and expertise, this latches & flip-flops device offers unparalleled performance and reliability. Whether you're working on consumer electronics, industrial automation, or telecommunications systems, this product provides seamless integration and efficient operation. Trust in Texas Instruments to deliver cutting-edge technology that enhances your designs and brings your ideas to life. Choose the SN74AUC1G79DCKRG4 for quality, value, and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

A durable and lightweight material that helps protect the internal components of the product.

Propagation Delay At Nominal Supply: 3.9 ns

Low propagation delay ensures quick response times for the latch or flip-flop operation.

Surface Mount: YES

Easy to install and saves space on the PCB by directly mounting onto the surface.

Nominal Supply Voltage / Vsup (V): 1.2

Operates efficiently at a low supply voltage, reducing power consumption.

Load Capacitance (CL): 15 pF

Designed to work efficiently with a specific load capacitance for optimal performance.

Maximum I (ol): 9 Amp

High output current capability allows for driving larger loads with ease.

Output Characteristics: 3-STATE

Supports three output states (high, low, and high impedance), providing versatility in signal routing.

Trigger Type: POSITIVE EDGE

Activated by a positive edge trigger signal, allowing for precise control over the latching operation.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, ensuring reliability in various environments.

Technical Specifications

Latches & Flip-Flops SN74AUC1G79DCKRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

200000000 Hz

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

275 MHz

Trade Compliance

SN74AUC1G79DCKRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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