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SN74AUC1G74DCURG4

Texas Instruments

SN74AUC1G74DCURG4 by Texas Instruments

D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR;

Median Price

$0.436

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 230,750 parts In-Stock

1+ parts

$0.436

100+ parts

$0.296

1k+ parts

$0.152

10k+ parts

-

230,750

$0.436

$0.296

$0.152

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.152

100+ parts

-

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-

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-

100

$0.152

-

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-

Digiode

USA . 3,566 parts In-Stock

1+ parts

$0.414

100+ parts

-

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-

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3,566

$0.414

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-

Chip Stock

USA . 99,960 parts In-Stock

1+ parts

-

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99,960

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-

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Vyrian

USA . 8,811 parts In-Stock

1+ parts

-

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-

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8,811

-

-

-

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Distributors (Availability)

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Netroflash

USA . 500 parts In-Stock

1+ parts

$0.152

100+ parts

-

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-

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-

500

$0.152

-

-

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Ampacity Inc.

Singapore . 230,636 parts In-Stock

1+ parts

$0.371

100+ parts

-

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-

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230,636

$0.371

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Corphita

USA . 4,731 parts In-Stock

1+ parts

$0.392

100+ parts

-

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-

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4,731

$0.392

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Parana Technologies

USA . 1,257 parts In-Stock

1+ parts

$12.013

100+ parts

$1,115.610

1k+ parts

$10.812

10k+ parts

-

1,257

$12.013

$1,115.610

$10.812

-

DigiPath Technology Company

USA . 315 parts In-Stock

1+ parts

$13.228

100+ parts

$12.170

1k+ parts

-

10k+ parts

-

315

$13.228

$12.170

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ChromeModa Solutions

Germany . 5,702 parts In-Stock

1+ parts

$13.498

100+ parts

$11.068

1k+ parts

-

10k+ parts

-

5,702

$13.498

$11.068

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IDEA Electronic Components Group

UK . 1,420 parts In-Stock

1+ parts

$13.498

100+ parts

$12.823

1k+ parts

$12.148

10k+ parts

-

1,420

$13.498

$12.823

$12.148

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AZTECH Wire

Italy . 1,008 parts In-Stock

1+ parts

$16.110

100+ parts

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1,008

$16.110

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Microchip USA

USA . 1,916 parts In-Stock

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1,916

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Technical Specifications

Latches & Flip-Flops SN74AUC1G74DCURG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

200000000 Hz

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.8 ns

Propagation Delay (tpd):

3.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

275 MHz

Trade Compliance

SN74AUC1G74DCURG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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