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SN74ALS175DR

Texas Instruments

SN74ALS175DR by Texas Instruments

SN74ALS175DR by Texas Instruments is a TTL technology latch with 4 bits, 17 ns propagation delay, and 50 MHz max frequency. It operates at a supply voltage of 5V and has a load capacitance of 50 pF. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$0.960

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 691 parts In-Stock

1+ parts

$0.960

100+ parts

$0.816

1k+ parts

$0.636

10k+ parts

$0.473

691

$0.960

$0.816

$0.636

$0.473

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 2,300 parts In-Stock

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$0.770

100+ parts

$0.580

1k+ parts

$0.500

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2,300

$0.770

$0.580

$0.500

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Digiode

USA . 1,879 parts In-Stock

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$1.539

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$1.539

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Mil-Aero Solutions, Inc.

USA . 9,000 parts In-Stock

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Vyrian

USA . 8,593 parts In-Stock

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Microfarads

USA . 7,006 parts In-Stock

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Prism Electronics

USA . 5,000 parts In-Stock

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Bristol Electronics

USA . 4,779 parts In-Stock

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PC Components Company LLC

USA . 2,500 parts In-Stock

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Inventory MP

USA . 2,279 parts In-Stock

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Connector Distribution Corp

USA . 1,000 parts In-Stock

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Right Parts Inc.

USA . 1,000 parts In-Stock

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Speed Components Ltd

Israel . 70 parts In-Stock

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Lantek

USA . 24 parts In-Stock

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Elcom Components

USA . 5 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 609 parts In-Stock

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$0.840

100+ parts

$0.580

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609

$0.840

$0.580

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Corphita

USA . 2,341 parts In-Stock

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$1.458

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Microchip USA

USA . 1,399 parts In-Stock

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$2.380

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Parana Technologies

USA . 1,668 parts In-Stock

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$12.158

100+ parts

$1,129.082

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$10.942

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1,668

$12.158

$1,129.082

$10.942

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DigiPath Technology Company

USA . 1,540 parts In-Stock

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$13.388

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$13.388

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ChromeModa Solutions

Germany . 6,905 parts In-Stock

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$13.661

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$11.202

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IDEA Electronic Components Group

UK . 2,226 parts In-Stock

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$13.661

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$12.978

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$12.295

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Perfect Parts

USA . 15,902 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,566 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,627 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Upgrade your electronic projects with the high-quality SN74ALS175DR latch and flip-flop by Texas Instruments. Built to last, this versatile component offers reliable performance and precision engineering, making it ideal for a wide range of applications. With a compact design and fast propagation delay, this product ensures seamless operation and efficient data handling. Experience the value and benefits of Texas Instruments technology with the SN74ALS175DR, perfect for electronics enthusiasts and professionals alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resilience, making it suitable for long-term use.

Propagation Delay At Nominal Supply: 17 ns

Low propagation delay ensures quick response times for signal processing.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape makes it compatible with standard electronic components and design layouts.

No. of Bits: 4

4 bits provide sufficient capacity for data storage and processing.

Nominal Supply Voltage / Vsup (V): 5

Nominal supply voltage of 5V is standard and widely available in electronic systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transmission and reception.

Power Supplies (V): 5

Consistent power supply of 5V ensures reliable performance.

No. of Terminals: 16

Sufficient terminals for connecting to other components and circuits.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space and is ideal for dense electronic layouts.

Maximum I (ol): 8 Amp

High maximum output current of 8A allows for robust signal handling.

Propagation Delay (tpd): 17 ns

Consistent propagation delay of 17ns ensures accurate signal timing.

Maximum Operating Temperature: 70 °C

Wide operating temperature range of up to 70°C for versatile use.

Trigger Type: POSITIVE EDGE

Positive edge trigger type for precise signal detection and processing.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish for reliable and corrosion-resistant connections.

Terminal Position: DUAL

Dual terminal position for flexible installation and compatibility.

Maximum Seated Height: 1.75 mm

Low seated height for compact design and space-saving installation.

Width: 3.91 mm

Narrow width for easy integration into tight spaces or crowded circuit boards.

Output Polarity: COMPLEMENTARY

Complementary output polarity for balanced signal processing.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage of 4.5V for efficient power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature for reliable soldering and component bonding.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C for secure solder joints and component attachment.

Length: 9.9 mm

Moderate length for versatile installation and compatibility with standard electronic layouts.

Temperature Grade: COMMERCIAL

Commercial grade temperature tolerance for reliable performance in standard operating environments.

Maximum Frequency At Nominal Supply: 50000000 Hz

High maximum frequency at nominal supply for quick signal processing and data transmission.

Technology: TTL

TTL technology for reliable and efficient digital signal processing.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and secure electrical connections.

Packing Method: TR

TR packing method for convenient handling and storage.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm for compatibility with common electronic components.

Minimum fmax: 50 MHz

Minimum fmax of 50MHz ensures high-speed signal processing and data transmission.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage of 5.5V for secure and efficient power input.

Maximum Power Supply Current (ICC): 14 mA

Maximum power supply current of 14mA for efficient power consumption and heat management.

Technical Specifications

Latches & Flip-Flops SN74ALS175DR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

50000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

14 mA

Propagation Delay At Nominal Supply:

17 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.91 mm

Minimum fmax:

50 MHz

Trade Compliance

SN74ALS175DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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