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SN54AS873JT

Texas Instruments

SN54AS873JT by Texas Instruments

SN54AS873JT by Texas Instruments is a 4-bit bus driver with 2 functions, featuring a propagation delay of 14 ns at 5V. With a package style of IN-LINE and through-hole terminal form, it operates in military-grade temperatures from -55 to 125°C. Ideal for applications requiring high-speed signal transmission in harsh environments.

Median Price

$4.088

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 89 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

89

-

$3.130

$2.800

$2.630

DigiKey

USA . 89 parts In-Stock

1+ parts

-

100+ parts

$4.110

1k+ parts

-

10k+ parts

-

89

-

$4.110

-

-

Verical

USA . 89 parts In-Stock

1+ parts

-

100+ parts

$4.088

1k+ parts

$3.700

10k+ parts

-

89

-

$4.088

$3.700

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 261 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

-

10k+ parts

-

261

$3.306

-

-

-

Forefront Electronics and Design

USA . 3 parts In-Stock

1+ parts

$24.500

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$24.500

-

-

-

Vyrian

USA . 6,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,905

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,024 parts In-Stock

1+ parts

$3.132

100+ parts

-

1k+ parts

-

10k+ parts

-

4,024

$3.132

-

-

-

Andel Nordic

Denmark . 4,031 parts In-Stock

1+ parts

$4.219

100+ parts

-

1k+ parts

$4.050

10k+ parts

$4.050

4,031

$4.219

-

$4.050

$4.050

Parana Technologies

USA . 266 parts In-Stock

1+ parts

$16.711

100+ parts

-

1k+ parts

$16.966

10k+ parts

-

266

$16.711

-

$16.966

-

DigiPath Technology Company

USA . 2,023 parts In-Stock

1+ parts

$18.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,023

$18.400

-

-

-

ChromeModa Solutions

Germany . 5,878 parts In-Stock

1+ parts

$18.776

100+ parts

$15.396

1k+ parts

-

10k+ parts

-

5,878

$18.776

$15.396

-

-

IDEA Electronic Components Group

UK . 1,978 parts In-Stock

1+ parts

$18.776

100+ parts

$17.837

1k+ parts

$16.898

10k+ parts

-

1,978

$18.776

$17.837

$16.898

-

Microchip USA

USA . 2,229 parts In-Stock

1+ parts

$21.710

100+ parts

$21.580

1k+ parts

$21.510

10k+ parts

$21.440

2,229

$21.710

$21.580

$21.510

$21.440

Overview

Enhance your electronic projects with the high-quality SN54AS873JT bus driver & transceiver by Texas Instruments. With a reputation for excellence, Texas Instruments delivers reliable components that meet the demands of various applications. This versatile 4-bit device boasts a 3-STATE output, true output polarity, and fast 14 ns propagation delay, making it ideal for military-grade projects. Trust in the value and benefits this product offers, providing customers with top-notch performance and reliability for their designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package provides durability and protection for the internal components, ensuring reliable performance in various conditions.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures fast signal transmission, making this bus driver efficient for time-sensitive applications.

No. of Functions: 2

Having multiple functions in a single device saves space and simplifies circuit design, making it a cost-effective choice.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with many existing systems and power sources.

Load Capacitance (CL): 50 pF

Suitable load capacitance allows for stable signal transmission without distortion, ensuring reliable communication.

Output Characteristics: 3-STATE

3-state output allows for the bus driver to effectively control the bus lines, enabling efficient sharing of resources in a multi-device system.

Technology: TTL

TTL technology ensures compatibility with TTL logic levels, making it easy to integrate this bus driver into existing TTL-based systems.

Technical Specifications

Bus Driver & Transceivers SN54AS873JT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR

Family:

AS

JESD-30 Code:

R-GDIP-T24

Length:

32.005 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

110 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54AS873JT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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