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SE555JG883

Texas Instruments

SE555JG883 by Texas Instruments

SE555JG883 by Texas Instruments is an Analog Waveform Generation IC with 8 terminals and a supply voltage range of 4.5V to 18V. It operates in temperatures from -55°C to 125°C, making it suitable for military-grade applications. The package style is in-line, with a rectangular shape and ceramic, metal-sealed co-fired body material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,384 parts In-Stock

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4,384

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Digiode

USA . 3,563 parts In-Stock

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3,563

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,564 parts In-Stock

1+ parts

$4.500

100+ parts

-

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1,564

$4.500

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Semicontronic

India . 959 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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959

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 489 parts In-Stock

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$5.500

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489

$5.500

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Parana Technologies

USA . 429 parts In-Stock

1+ parts

$7.014

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$7.571

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429

$7.014

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$7.571

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DigiPath Technology Company

USA . 1,247 parts In-Stock

1+ parts

$7.723

100+ parts

$7.106

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1,247

$7.723

$7.106

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ChromeModa Solutions

Germany . 2,195 parts In-Stock

1+ parts

$7.881

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$6.462

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2,195

$7.881

$6.462

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IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$7.881

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$7.093

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2,080

$7.881

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$7.093

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AZTECH Wire

Italy . 660 parts In-Stock

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$16.651

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660

$16.651

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Corphita

USA . 439 parts In-Stock

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439

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Corohmni

South Africa . 92 parts In-Stock

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92

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Overview

Unleash the power of precision and reliability with the SE555JG883 by Texas Instruments. As a leader in analog waveform generation, Texas Instruments ensures top-notch quality and performance in every product. Ideal for military-grade applications, this rectangular-shaped IC offers a wide supply voltage range of 4.5V to 18V, making it versatile for various projects. With a durable ceramic body and MIL-STD-883 screening level, customers can trust in the durability and longevity of this superior component. Upgrade your designs with the SE555JG883 and experience unmatched value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making the product suitable for harsh environments.

Screening Level: MIL-STD-883

Compliance with this standard ensures high quality and reliability, making it a preferred choice for critical applications.

Nominal Supply Voltage (Vsup): 5 V

The specified voltage allows for consistent and stable operation of the product.

No. of Terminals: 8

Having multiple terminals allows for flexibility and compatibility with various systems and configurations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature indicates the product's ability to perform reliably in extreme conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the product can function in a wide range of environments.

Terminal Finish: TIN LEAD

The use of Tin Lead finish provides enhanced solderability and conductivity for secure connections.

Width (mm): 7.62 mm

The compact width makes the product suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 4.5 V

The lower minimum supply voltage allows for efficient operation even at lower power levels.

Temperature Grade: MILITARY

The military-grade temperature specifications ensure ruggedness and performance in demanding military applications.

Technical Specifications

Analog Waveform Generation SE555JG883 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-CDIP-T8

JESD-609 Code:

e0

Length:

9.58 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

SE555JG883 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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