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SE555CD

Texas Instruments

SE555CD by Texas Instruments

SE555CD by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It features a small outline package, dual terminal position, and operates in temperatures from -55°C to 125°C. Ideal for military-grade applications requiring pulse and rectangular wave generation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,938 parts In-Stock

1+ parts

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8,938

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Digiode

USA . 561 parts In-Stock

1+ parts

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561

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 176 parts In-Stock

1+ parts

$3.500

100+ parts

-

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176

$3.500

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Semicontronic

India . 184 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

184

$5.500

$5.362

$5.335

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Parana Technologies

USA . 111 parts In-Stock

1+ parts

$6.032

100+ parts

-

1k+ parts

$6.808

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111

$6.032

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$6.808

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DigiPath Technology Company

USA . 2,080 parts In-Stock

1+ parts

$6.641

100+ parts

$6.110

1k+ parts

-

10k+ parts

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2,080

$6.641

$6.110

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ChromeModa Solutions

Germany . 5,464 parts In-Stock

1+ parts

$6.777

100+ parts

$5.557

1k+ parts

-

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5,464

$6.777

$5.557

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IDEA Electronic Components Group

UK . 2,022 parts In-Stock

1+ parts

$6.777

100+ parts

-

1k+ parts

$6.099

10k+ parts

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2,022

$6.777

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$6.099

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One Stop Electronics

USA . 202 parts In-Stock

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$7.500

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202

$7.500

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AZTECH Wire

Italy . 289 parts In-Stock

1+ parts

$14.104

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289

$14.104

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Corphita

USA . 1,636 parts In-Stock

1+ parts

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1,636

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Corohmni

South Africa . 333 parts In-Stock

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333

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Overview

Unlock endless possibilities with the SE555CD by Texas Instruments, a high-quality analog waveform generation IC that delivers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this versatile component is perfect for a wide range of applications in electronics, communications, and more. With its compact size and advanced technology, the SE555CD provides exceptional value, benefits, and advantages to customers seeking superior functionality and precision in their designs. Discover the potential of the SE555CD today and take your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the waveform generation device.

Surface Mount: YES

Being surface mountable makes installation and mounting of the device easier and more convenient, especially in compact electronic circuits.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this waveform generation device can function reliably in extreme cold environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the device to withstand elevated temperatures without compromising performance.

Technology: BIPOLAR

The bipolar technology used in this device offers high precision and accuracy in waveform generation, making it suitable for applications that require stable and reliable output signals.

Technical Specifications

Analog Waveform Generation SE555CD attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

SE555CD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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