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SE5534U

Texas Instruments

SE5534U by Texas Instruments

SE5534U by Texas Instruments is a MILITARY-grade OPERATIONAL AMPLIFIER with VOLTAGE-FEEDBACK architecture. It operates at temperatures from -55 to 125 °C and has +-15V power supplies. With 10 terminals in a RECTANGULAR package, it's ideal for applications requiring high-frequency compensation and a nominal voltage of 15V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,041 parts In-Stock

1+ parts

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6,041

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Digiode

USA . 4,173 parts In-Stock

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4,173

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,636 parts In-Stock

1+ parts

$3.156

100+ parts

-

1k+ parts

$3.675

10k+ parts

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1,636

$3.156

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$3.675

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DigiPath Technology Company

USA . 2,177 parts In-Stock

1+ parts

$3.475

100+ parts

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2,177

$3.475

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ChromeModa Solutions

Germany . 5,317 parts In-Stock

1+ parts

$3.546

100+ parts

$2.908

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5,317

$3.546

$2.908

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IDEA Electronic Components Group

UK . 385 parts In-Stock

1+ parts

$3.546

100+ parts

-

1k+ parts

$3.191

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385

$3.546

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$3.191

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One Stop Electronics

USA . 1,375 parts In-Stock

1+ parts

$8.410

100+ parts

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1,375

$8.410

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AZTECH Wire

Italy . 389 parts In-Stock

1+ parts

$18.343

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389

$18.343

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Corphita

USA . 4,723 parts In-Stock

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4,723

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Overview

Experience the superior quality and reliability of Texas Instruments with the SE5534U Operational Amplifier. This versatile component is perfect for a wide range of applications, from audio equipment to industrial machinery. With its advanced technology and military-grade temperature tolerance, the SE5534U ensures optimal performance in any environment. Trust Texas Instruments for unmatched value and innovation in operational amplifiers.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide better thermal conductivity and stability, making the product suitable for high temperature operations and ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit board layouts, saving space and enabling easier automation in manufacturing processes.

Nominal Supply Voltage / Vsup (V): 15

Operating at a nominal supply voltage of 15V allows for compatibility with a wide range of electronic systems and applications.

Power Supplies (V): +-15

Dual power supply of +-15V enables the op amp to handle both positive and negative voltage signals efficiently, making it versatile for various signal processing tasks.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this op amp can withstand elevated temperatures without performance degradation, suitable for industrial and automotive applications.

Frequency Compensation: YES (AVCL>=3)

Frequency compensation ensures stability and prevents oscillation in the op amp, making it reliable for applications requiring precise signal processing and feedback.

Technology: BIPOLAR

Bipolar technology provides high gain and accuracy, making it suitable for applications requiring precision amplification and signal conditioning.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides high linearity and low distortion, making this op amp ideal for applications requiring accurate voltage amplification and signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) SE5534U attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

YES (AVCL>=3)

Low-Offset:

No

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Negative Supply Voltage:

-15 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

10

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-XDFP-F10

Packaging and Shipping

Package Code:

DFP

Package Shape:

Package Style:

Flatpack

Package Equivalence Code:

FL10,.3

Trade Compliance

SE5534U Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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