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SE5534AFK/883B

Texas Instruments

SE5534AFK/883B by Texas Instruments

SE5534AFK/883B by Texas Instruments is a MIL-STD-883 Class B operational amplifier with 20 terminals. It operates b/w -55°C to 125°C, with ±15V power supplies and voltage-feedback architecture. Suitable for military applications requiring high-frequency compensation and bipolar technology in a ceramic chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,843 parts In-Stock

1+ parts

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9,843

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Digiode

USA . 4,386 parts In-Stock

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4,386

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 585 parts In-Stock

1+ parts

$1.255

100+ parts

-

1k+ parts

$2.024

10k+ parts

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585

$1.255

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$2.024

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DigiPath Technology Company

USA . 156 parts In-Stock

1+ parts

$1.382

100+ parts

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156

$1.382

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ChromeModa Solutions

Germany . 4,043 parts In-Stock

1+ parts

$1.410

100+ parts

$1.156

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4,043

$1.410

$1.156

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IDEA Electronic Components Group

UK . 571 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

$1.269

10k+ parts

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571

$1.410

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$1.269

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One Stop Electronics

USA . 1,171 parts In-Stock

1+ parts

$2.410

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1,171

$2.410

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AZTECH Wire

Italy . 222 parts In-Stock

1+ parts

$12.065

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222

$12.065

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Corphita

USA . 3,078 parts In-Stock

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3,078

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Overview

Experience superior performance and reliability with the SE5534AFK/883B by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch operational amplifiers that are perfect for a wide range of applications. From industrial to military use, this high-quality product offers exceptional value, benefits, and advantages to customers looking for precision and efficiency. Upgrade your projects with the SE5534AFK/883B and enjoy unparalleled performance backed by Texas Instruments' reputation for excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and stable material, making it ideal for ensuring reliable performance and longevity in various environments.

Surface Mount: YES

Allows for easy installation and compatibility with modern PCB designs, saving space and simplifying assembly processes.

Screening Level: MIL-STD-883 Class B (Modified)

Meets stringent military standards for quality and reliability, ensuring consistent performance in demanding applications.

Nominal Supply Voltage / Vsup (V): 15

Provides a stable and suitable operating voltage for optimal performance in a variety of circuit designs.

Frequency Compensation: YES (AVCL>=3)

Ensures stability and prevents oscillations, improving overall accuracy and precision in signal processing.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, allowing for reliable operation in challenging environments without risk of failure.

Technology: BIPOLAR

Offers high performance and low noise characteristics, making it suitable for applications that require precision and efficiency.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying signals with high accuracy and low distortion, making it ideal for various signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) SE5534AFK/883B attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

YES (AVCL>=3)

Low-Offset:

No

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Negative Supply Voltage:

-15 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883 Class B (Modified)

Standards

JESD-30 Code:

S-XQCC-N20

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

SE5534AFK/883B Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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