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SE5534FH

Texas Instruments

SE5534FH by Texas Instruments

SE5534FH by Texas Instruments is a ceramic square chip carrier operational amplifier with +-15V power supplies. It operates in temperatures ranging from -55 to 125°C, suitable for military-grade applications. Featuring voltage-feedback architecture and frequency compensation, it has 20 terminals with a terminal pitch of 1.27mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,835 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,835

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Digiode

USA . 1,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,222

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 805 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

-

10k+ parts

-

805

$1.410

-

-

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Parana Technologies

USA . 475 parts In-Stock

1+ parts

$2.477

100+ parts

-

1k+ parts

$2.969

10k+ parts

-

475

$2.477

-

$2.969

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DigiPath Technology Company

USA . 2,054 parts In-Stock

1+ parts

$2.727

100+ parts

$2.509

1k+ parts

-

10k+ parts

-

2,054

$2.727

$2.509

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ChromeModa Solutions

Germany . 1,142 parts In-Stock

1+ parts

$2.783

100+ parts

$2.282

1k+ parts

-

10k+ parts

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1,142

$2.783

$2.282

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IDEA Electronic Components Group

UK . 1,047 parts In-Stock

1+ parts

$2.783

100+ parts

-

1k+ parts

$2.505

10k+ parts

-

1,047

$2.783

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$2.505

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AZTECH Wire

Italy . 193 parts In-Stock

1+ parts

$13.720

100+ parts

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10k+ parts

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193

$13.720

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Corphita

USA . 3,832 parts In-Stock

1+ parts

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3,832

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Overview

Experience superior performance and reliability with the SE5534FH by Texas Instruments. As a leading manufacturer of Operational Amplifiers (Op Amps), Texas Instruments delivers cutting-edge technology and innovation in every product. The SE5534FH is perfect for a wide range of applications, offering unmatched precision and efficiency. With its military-grade temperature rating and voltage-feedback architecture, this chip carrier package ensures optimal performance even in extreme conditions. Trust Texas Instruments to provide you with the quality and value you need for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal performance and high reliability, making it suitable for demanding applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation on PCBs, saving space and improving assembly processes.

Nominal Supply Voltage / Vsup (V): 15

Operates at a nominal supply voltage of 15V, which is common in many electronic systems, providing compatibility and ease of integration.

Power Supplies (V): +-15

Supports dual power supplies of +-15V, allowing for flexible and versatile power configurations.

No. of Terminals: 20

Provides a sufficient number of terminals for connecting to external components and circuits, enabling versatile circuit designs.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures up to 125°C, suitable for harsh environments and extended operating conditions.

Frequency Compensation: YES (AVCL>=3)

Frequency compensation capabilities ensure stability and performance in various feedback configurations, enhancing operational efficiency.

Minimum Operating Temperature: -55 °C

Capable of functioning at low temperatures down to -55°C, allowing for use in a wide range of environmental conditions.

Terminal Position: QUAD

Quad terminal configuration simplifies circuit layout and connections, improving overall system integration and reliability.

Temperature Grade: MILITARY

Military-grade temperature rating ensures robustness and durability in extreme temperature environments, suitable for critical applications.

Technology: BIPOLAR

Utilizes bipolar technology for high precision and low noise performance, making it ideal for precision measurement and signal processing applications.

Terminal Form: NO LEAD

No-lead terminal form enhances reliability and eliminates potential solder joint failures, ensuring long-term performance and connectivity.

Amplifier Type: OPERATIONAL AMPLIFIER

Voltage-feedback operational amplifier design provides high gain, bandwidth, and linearity, making it suitable for a wide range of signal processing applications.

Nominal Negative Supply Voltage (Vsup): -15 V

Supports a nominal negative supply voltage of -15V, enabling symmetric power supply configurations for balanced signal processing.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture ensures stable and predictable performance in various feedback applications, offering consistent amplification and signal conditioning.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch facilitates easy and precise connections, enabling efficient PCB layout and assembly processes.

Technical Specifications

Operational Amplifiers (Op Amps) SE5534FH attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

YES (AVCL>=3)

Low-Offset:

No

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Negative Supply Voltage:

-15 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-XQCC-N20

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

SE5534FH Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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