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SE5534AFH/883B

Texas Instruments

SE5534AFH/883B by Texas Instruments

SE5534AFH/883B by Texas Instruments is a MIL-STD-883 Class B Op Amp with 20 terminals in a chip carrier package. It operates b/w -55°C to 125°C, with ±15V power supplies and voltage-feedback architecture. Ideal for military applications requiring high-frequency compensation and bipolar technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,496 parts In-Stock

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7,496

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Digiode

USA . 2,788 parts In-Stock

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2,788

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,398 parts In-Stock

1+ parts

$0.979

100+ parts

-

1k+ parts

$1.870

10k+ parts

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1,398

$0.979

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$1.870

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DigiPath Technology Company

USA . 855 parts In-Stock

1+ parts

$1.078

100+ parts

$0.992

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-

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855

$1.078

$0.992

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ChromeModa Solutions

Germany . 3,732 parts In-Stock

1+ parts

$1.100

100+ parts

$0.902

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3,732

$1.100

$0.902

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IDEA Electronic Components Group

UK . 153 parts In-Stock

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$1.100

100+ parts

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$0.990

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153

$1.100

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$0.990

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One Stop Electronics

USA . 430 parts In-Stock

1+ parts

$1.410

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430

$1.410

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AZTECH Wire

Italy . 710 parts In-Stock

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$16.372

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710

$16.372

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Corphita

USA . 1,099 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the SE5534AFH/883B operational amplifier by Texas Instruments. Crafted with top-tier materials and cutting-edge technology, this high-performance op amp is designed to excel in military-grade applications. With a wide temperature range and frequency compensation, this chip carrier style op amp offers unmatched stability and accuracy. Trust Texas Instruments for quality products that deliver exceptional results every time. Elevate your projects with the SE5534AFH/883B and experience the difference that superior craftsmanship can make.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and durability, making the product suitable for high temperature and harsh environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, reducing overall production time and cost.

Screening Level: MIL-STD-883 Class B (Modified)

MIL-STD-883 Class B screening ensures high reliability and quality standards, making this product ideal for critical applications in military and aerospace sectors.

Nominal Supply Voltage / Vsup (V): 15

Suitable operating voltage for various applications, providing stable performance and efficiency.

Power Supplies (V): +-15

Dual power supplies support bipolar operation and enhance the versatility of the operational amplifier.

No. of Terminals: 20

Sufficient number of terminals for connections and configurations, allowing for flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact form factor and space-saving design, ideal for applications with limited board space.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability in extreme conditions.

Frequency Compensation: YES (AVCL>=3)

Frequency compensation feature ensures stability and performance of the operational amplifier, especially in applications with feedback loops.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Position: QUAD

Quad terminal arrangement simplifies PCB layout and connections, enhancing ease of use and installation.

Temperature Grade: MILITARY

Military-grade temperature rating ensures performance and reliability under harsh environmental conditions, making this product suitable for defense and aerospace applications.

Technology: BIPOLAR

Bipolar technology offers high accuracy and precision in signal processing, making it ideal for applications requiring high performance.

Terminal Form: NO LEAD

No lead terminals provide reliable connections and solder joints, reducing the risk of mechanical failure and ensuring long-term performance.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design offers high gain and performance for a wide range of applications, including signal processing and amplification.

Nominal Negative Supply Voltage (Vsup): -15 V

Negative supply voltage support enables bipolar operation and allows for versatile configuration in circuits.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides precise control and stability, ensuring accurate signal processing and amplification.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with common PCB designs and components, facilitating integration and ease of use.

Technical Specifications

Operational Amplifiers (Op Amps) SE5534AFH/883B attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

YES (AVCL>=3)

Low-Offset:

No

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Negative Supply Voltage:

-15 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883 Class B (Modified)

Standards

JESD-30 Code:

S-XQCC-N20

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

SE5534AFH/883B Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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