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RM48L952ZWTT

Texas Instruments

RM48L952ZWTT by Texas Instruments

Texas Instruments RM48L952ZWTT is a 32-bit microcontroller with Cortex-R4F CPU family, 262144 RAM Bytes, and 3145728 ROM Words. It operates at a max clock frequency of 80 MHz and has ADC and DMA channels for versatile industrial applications. With a temperature range from -40 to 105 °C, it offers high performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,049 parts In-Stock

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Digiode

USA . 2,797 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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90

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One Stop Electronics

USA . 454 parts In-Stock

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$2.000

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454

$2.000

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AZTECH Wire

Italy . 792 parts In-Stock

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$10.230

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792

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Parana Technologies

USA . 1,476 parts In-Stock

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$39.168

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$39.168

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DigiPath Technology Company

USA . 531 parts In-Stock

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$43.129

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531

$43.129

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ChromeModa Solutions

Germany . 3,012 parts In-Stock

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$44.009

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$36.087

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3,012

$44.009

$36.087

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IDEA Electronic Components Group

UK . 212 parts In-Stock

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$44.009

100+ parts

$41.809

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$39.608

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212

$44.009

$41.809

$39.608

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Lixinc

USA . 10,915 parts In-Stock

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Perfect Parts

USA . 824 parts In-Stock

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Corphita

USA . 590 parts In-Stock

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590

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Microchip USA

USA . 247 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 90 parts In-Stock

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Glotronic Ltd.

UK . 72 parts In-Stock

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Overview

Discover the RM48L952ZWTT by Texas Instruments, a top-of-the-line microcontroller that boasts unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this powerful device opens up a world of possibilities in various applications. With cutting-edge technology and advanced features, this microcontroller ensures optimal performance and seamless integration. Embrace innovation and unlock limitless potential with the RM48L952ZWTT, delivering unmatched value and benefits to customers seeking top-tier solutions in the microcontroller category.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package, ensuring the safety of the microcontroller.

Surface Mount: YES

Easy to mount on PCBs without the need for additional hardware, saving space and simplifying assembly.

Maximum Supply Voltage: 1.32 V

Operates within a safe voltage range, protecting the microcontroller from potential damage.

Bit Size: 32

High bit size allows for processing of complex instructions and data, suitable for a wide range of applications.

Power Supplies (V): 1.2,3.3

Multiple power supply options provide flexibility in designing circuits and power management.

No. of Terminals: 337

Sufficient number of terminals for connecting peripherals and external components to the microcontroller.

Package Style (Meter): GRID ARRAY

Grid array package style offers better mechanical strength and thermal performance.

Minimum Supply Voltage: 1.14 V

Allows for operation at lower voltages, improving energy efficiency.

Maximum Operating Temperature: 105 °C

Wide operating temperature range suitable for industrial applications where temperature fluctuations are common.

CPU Family: CORTEX-R4F

High-performance ARM Cortex-R4F CPU family provides efficient processing capabilities.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments, making it versatile for different applications.

Terminal Finish: TIN SILVER COPPER

Enhanced terminal finish for improved conductivity and reliability in signal transmission.

ADC Channels: YES

Integrated analog-to-digital converter channels for sensing and processing analog signals.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal position for easier integration and connectivity in PCB designs.

ROM Words: 3145728

Large ROM capacity for storing program instructions and data, suitable for demanding applications.

Maximum Clock Frequency: 80 MHz

High clock frequency for fast and efficient processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

Sustainable time at peak reflow temperature for reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature suitable for lead-free soldering processes, ensuring environmental compliance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and optimized processing of instructions, suitable for real-time applications.

RAM Bytes: 262144

Large RAM capacity for temporary data storage and fast access by the CPU.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable solder joints and mechanical strength in the package.

Maximum Supply Current: 400 mA

Moderate supply current requirement for optimized power consumption.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent performance and power efficiency.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog signals and motor speed.

ROM Programmability: FLASH

Flash ROM programmability for easy and fast reprogramming of firmware and data.

Terminal Pitch: 0.8 mm

Fine terminal pitch for compact design and space-saving on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 level for safe handling and storage of the microcontroller to prevent moisture-related damage.

Speed: 220 rpm

High-speed performance suitable for time-critical applications and real-time data processing.

No. of I/O Lines: 16

Sufficient number of input/output lines for connecting to external devices and sensors.

Technical Specifications

Microcontrollers RM48L952ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

X-PBGA-B337

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Speed:

220 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

RM48L952ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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