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RM48L740ZWTT

Texas Instruments

RM48L740ZWTT by Texas Instruments

The Texas Instruments RM48L740ZWTT microcontroller features a 32-bit Cortex-R4F CPU, 262144 bytes of RAM, and 2097152 ROM words. With a max clock frequency of 80 MHz, it is ideal for industrial applications requiring high-speed processing and control capabilities. The microcontroller also offers ADC and DMA channels for efficient data acquisition and transfer tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,859 parts In-Stock

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4,859

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Digiode

USA . 2,016 parts In-Stock

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2,016

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Distributors (Availability)

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One Stop Electronics

USA . 723 parts In-Stock

1+ parts

$4.000

100+ parts

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723

$4.000

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AZTECH Wire

Italy . 360 parts In-Stock

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$16.973

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360

$16.973

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Parana Technologies

USA . 8 parts In-Stock

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$50.557

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8

$50.557

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DigiPath Technology Company

USA . 2,225 parts In-Stock

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$55.670

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2,225

$55.670

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ChromeModa Solutions

Germany . 4,494 parts In-Stock

1+ parts

$56.806

100+ parts

$46.581

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4,494

$56.806

$46.581

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IDEA Electronic Components Group

UK . 337 parts In-Stock

1+ parts

$56.806

100+ parts

$53.966

1k+ parts

$51.125

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337

$56.806

$53.966

$51.125

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Corphita

USA . 2,574 parts In-Stock

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Microchip USA

USA . 168 parts In-Stock

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Overview

Experience the next level of performance and efficiency with the Texas Instruments RM48L740ZWTT microcontroller. Designed with precision and reliability in mind, this high-quality product from a trusted manufacturer offers a wide range of applications in various industries. With its advanced features and cutting-edge technology, customers can expect seamless operation and enhanced functionality. Step up your game with the RM48L740ZWTT and unlock a world of possibilities for your projects. Elevate your creations with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers, providing durability and protection for the internal components.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly onto PCBs, making the product suitable for mass production.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V ensures that the microcontroller operates within safe voltage limits, enhancing its reliability.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it ideal for compact electronic devices.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and tasks, suitable for a wide range of applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2 V and 3.3 V) provides flexibility in designing and powering the system.

No. of Terminals: 337

Having a high number of terminals allows for multiple connections and functionalities, making the microcontroller versatile in its applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design with fine pitch terminals, enabling densely populated PCB layouts for space-constrained designs.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures the microcontroller can operate efficiently at lower power levels, saving energy.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this microcontroller can withstand harsh environmental conditions and high temperature operation.

CPU Family: CORTEX-R4F

The CORTEX-R4F CPU family offers high performance and real-time processing capabilities, making the microcontroller suitable for demanding applications that require fast response times.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable operation in cold environments, making the microcontroller suitable for a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the microcontroller.

ADC Channels: YES

Having analog-to-digital converter (ADC) channels enables the microcontroller to interface with analog sensors and signals, expanding its capabilities in data acquisition and processing.

DMA Channels: YES

Integrated direct memory access (DMA) channels allow for efficient data transfers between peripherals and memory, reducing CPU load and improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies accessibility and routing of connections on the PCB, enhancing ease of assembly and maintenance.

ROM Words: 2097152

With a large ROM capacity of 2097152 words, the microcontroller can store a significant amount of program code and data, suitable for complex applications.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm enables a slim and compact overall design, making the microcontroller ideal for space-constrained applications.

Width: 16 mm

The 16 mm width contributes to the compact form factor of the microcontroller, allowing for efficient use of space on the PCB.

Maximum Clock Frequency: 80 MHz

The maximum clock frequency of 80 MHz provides fast processing speeds, making the microcontroller suitable for applications requiring real-time data processing and high-speed computation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures that the microcontroller can withstand the reflow soldering process without damage, facilitating easy assembly onto PCBs.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C is compatible with standard reflow soldering techniques, ensuring reliable and robust solder joints during assembly.

Length: 16 mm

The 16 mm length contributes to the compact form factor of the microcontroller, making it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges, the microcontroller can operate reliably in harsh environments with wide temperature fluctuations, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers efficient and fast processing capabilities, making it suitable for real-time embedded applications that require quick response times.

RAM Bytes: 262144

With a large RAM capacity of 262144 bytes, the microcontroller can efficiently store and manipulate data during program execution, enabling complex algorithms and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form provides reliable connections and easier soldering during assembly, ensuring robust electrical connections for the microcontroller.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures stable and efficient operation of the microcontroller, meeting the power requirements of the system.

PWM Channels: YES

Having pulse-width modulation (PWM) channels enables the microcontroller to generate precise analog output signals, making it suitable for applications such as motor control and LED dimming.

ROM Programmability: FLASH

The use of flash ROM allows for easy programmability and updating of firmware, facilitating flexibility and customization of the microcontroller for different applications.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8 mm, the microcontroller allows for dense packing of terminals on the PCB, saving space and enabling high-density designs.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microcontroller can withstand moderate exposure to humidity during storage and assembly processes, ensuring long-term reliability.

Speed: 200 rpm

With a speed rating of 200 rpm, the microcontroller can process instructions and data at a fast rate, suitable for high-speed applications requiring rapid computation.

No. of I/O Lines: 16

The 16 I/O lines provide versatile input/output capabilities, allowing the microcontroller to interface with external devices and sensors, making it suitable for a wide range of applications.

Technical Specifications

Microcontrollers RM48L740ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQURIES AT 3.3 V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

RM48L740ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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