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PUCC28C52QDRQ1

Texas Instruments

PUCC28C52QDRQ1 by Texas Instruments

PUCC28C52QDRQ1 by Texas Instruments is a switching controller with AEC-Q100 screening. It operates b/w -40 to 150°C, supports max output voltage of 28V, and has a max switching frequency of 1MHz. Ideal for automotive applications due to its robust design and high-temperature range suitability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,050 parts In-Stock

1+ parts

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6,050

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Digiode

USA . 2,594 parts In-Stock

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2,594

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 409 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

409

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 1,401 parts In-Stock

1+ parts

$2.500

100+ parts

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1,401

$2.500

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One Stop Electronics

USA . 561 parts In-Stock

1+ parts

$5.500

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561

$5.500

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AZTECH Wire

Italy . 241 parts In-Stock

1+ parts

$9.958

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241

$9.958

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Corphita

USA . 3,583 parts In-Stock

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3,583

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Corohmni

South Africa . 299 parts In-Stock

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299

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Overview

Experience unprecedented efficiency and reliability with the PUCC28C52QDRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in their switching regulators & controllers, ensuring superior performance in a variety of applications. With its compact design and cutting-edge technology, this product offers unmatched value and benefits to customers looking for optimal power management solutions. Say goodbye to inefficiency and hello to seamless operation with the PUCC28C52QDRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and light weight, making the product suitable for various applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort.

Screening Level: AEC-Q100

Ensures high reliability and quality, especially for automotive applications.

Package Shape: RECTANGULAR

Helps in efficient placement on the PCB, optimizing space usage.

Maximum Operating Temperature: 150 °C

Allows for operation in high temperature environments, increasing versatility.

Control Mode: CURRENT-MODE

Provides efficient control over the output current, enhancing performance.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Maximum Output Voltage: 28 V

Supports a wide range of output voltage requirements for different applications.

Maximum Switching Frequency: 1000 kHz

Allows for fast response and regulation, improving overall efficiency.

Technical Specifications

Switching Regulators & Controllers PUCC28C52QDRQ1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

12 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDSO-G8

Length:

4.905 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.2 A

Maximum Output Voltage:

28 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

2 mA

Maximum Supply Voltage (Vsup):

28 V

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

1000 kHz

Technology:

BICMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.895 mm

Trade Compliance

PUCC28C52QDRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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