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PUCC14241QDWNQ1

Texas Instruments

PUCC14241QDWNQ1 by Texas Instruments

PUCC14241QDWNQ1 by Texas Instruments is a switching regulator with AEC-Q100 screening level. It operates b/w -40 to 125°C, with output voltage range of 15-25V. Ideal for automotive applications due to its compact size, dual terminals, and pulse width modulation control technique.

Median Price

$4.620

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$4.620

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Vyrian

USA . 5,266 parts In-Stock

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Digiode

USA . 3,594 parts In-Stock

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One Stop Electronics

USA . 1,196 parts In-Stock

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$6.500

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Ampacity Inc.

Singapore . 964 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 599 parts In-Stock

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$8.758

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Corphita

USA . 3,291 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$4.528

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$4.389

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$4.297

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Overview

Experience the next level of power management with the Texas Instruments PUCC14241QDWNQ1, a cutting-edge switching regulator & controller designed to deliver efficient and reliable performance. With a superior quality that only Texas Instruments can provide, this product offers unmatched value and benefits for a wide range of applications. From automotive to industrial settings, this small outline, high-performance device boasts dual terminal positions and a buck-boost switcher configuration to meet your specific needs. Trust in Texas Instruments to elevate your power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation, making it suitable for compact designs.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures the product meets automotive standards for quality and reliability.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space utilization, making it suitable for applications with space constraints.

No. of Terminals: 36

The high number of terminals provides flexibility and connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space and enhances thermal performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliable performance in harsh environments.

Minimum Output Voltage: 15 V

The minimum output voltage of 15V makes it suitable for applications requiring higher voltage outputs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments.

Maximum Output Voltage: 25 V

The maximum output voltage of 25V provides flexibility in meeting various voltage requirements.

Terminal Position: DUAL

The dual terminal position allows for easier PCB layout and circuit design.

Maximum Seated Height: 3.55 mm

The low seated height enables the product to be used in slim and compact devices.

Width (mm): 7.5 mm

The narrow width of 7.5mm makes it suitable for applications with limited space.

Other IC type: SWITCHING REGULATOR

The switching regulator type offers efficient power conversion and reduced energy loss.

Nominal Input Voltage: 24 V

The nominal input voltage of 24V provides compatibility with common power sources.

Length: 12.83 mm

The length of 12.83mm allows for flexibility in PCB layout and design.

Maximum Switching Frequency: 15000 kHz

The high switching frequency enables fast and efficient power conversion.

Maximum Supply Current (Isup): 250 mA

The high supply current allows for powering multiple components in the circuit.

Maximum Output Current: 0.1 A

The maximum output current of 0.1A is suitable for low-power applications.

Terminal Form: GULL WING

The gull wing terminal form provides ease of soldering and ensures mechanical stability.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique offers precise voltage regulation and efficiency.

Switcher Config: BUCK-BOOST

The buck-boost configuration allows for seamless transition between step-up and step-down voltage regulation.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting on the PCB.

Minimum Input Voltage: 21 V

The minimum input voltage of 21V ensures compatibility with a wide range of power sources.

No. of Outputs: 2

The dual output configuration provides flexibility for powering multiple devices in the circuit.

Maximum Input Voltage: 27 V

The high maximum input voltage of 27V offers versatility in input power source compatibility.

Technical Specifications

Switching Regulators & Controllers PUCC14241QDWNQ1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

27 V

Minimum Input Voltage:

21 V

Nominal Input Voltage:

24 V

JESD-30 Code:

R-PDSO-G36

Length:

12.83 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Maximum Output Voltage:

25 V

Minimum Output Voltage:

15 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

3.55 mm

Maximum Supply Current (Isup):

250 mA

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

15000 kHz

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

PUCC14241QDWNQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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