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PUCC256404DDB

Texas Instruments

PUCC256404DDB by Texas Instruments

PUCC256404DDB by Texas Instruments is a switching controller with 14 terminals, operating temperature range of -40 to 125°C. It features resonant control technique, supports input voltage from 13V to 26V, and delivers a max output current of 1.2A. Ideal for automotive applications due to its small outline package and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,511 parts In-Stock

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7,511

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Digiode

USA . 1,077 parts In-Stock

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1,077

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Distributors (Availability)

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Ampacity Inc.

Singapore . 929 parts In-Stock

1+ parts

$0.500

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929

$0.500

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One Stop Electronics

USA . 1,413 parts In-Stock

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$1.500

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1,413

$1.500

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Parana Technologies

USA . 1,771 parts In-Stock

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$2.946

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$3.446

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1,771

$2.946

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$3.446

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DigiPath Technology Company

USA . 75 parts In-Stock

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$3.244

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$2.984

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75

$3.244

$2.984

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IDEA Electronic Components Group

UK . 2,086 parts In-Stock

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$3.310

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$2.979

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2,086

$3.310

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$2.979

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ChromeModa Solutions

Germany . 1,103 parts In-Stock

1+ parts

$3.310

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$2.714

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1,103

$3.310

$2.714

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Semicontronic

India . 1,439 parts In-Stock

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$6.500

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$6.338

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$6.305

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1,439

$6.500

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$6.305

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AZTECH Wire

Italy . 611 parts In-Stock

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$17.934

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611

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Corphita

USA . 4,006 parts In-Stock

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4,006

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Corohmni

South Africa . 316 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the PUCC256404DDB switching regulator. This compact and efficient device is ideal for a wide range of applications, offering automotive-grade performance and a maximum output current of 1.2A. With its resonant control technique and dual terminal position, this product provides customers with exceptional value and benefits, ensuring optimal performance in challenging environments. Trust Texas Instruments to deliver cutting-edge solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the switching regulator, ensuring a longer product lifespan.

Surface Mount: YES

Ease of installation and compact design make it suitable for applications where space is limited.

Nominal Input Voltage: 15 V

Well-suited for applications requiring a stable input voltage of 15 volts.

Maximum Output Current: 1.2 A

Capable of delivering a maximum output current of 1.2 amps, making it suitable for powering various electronics.

Control Technique: RESONANT CONTROL

Efficient control technique that helps in reducing power losses and improving overall performance of the switching regulator.

Technical Specifications

Switching Regulators & Controllers PUCC256404DDB attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Technique:

RESONANT CONTROL

Maximum Input Voltage:

26 V

Minimum Input Voltage:

13 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDSO-G14

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

PUCC256404DDB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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