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PLL1708DBQRG4

Texas Instruments

PLL1708DBQRG4 by Texas Instruments

PLL1708DBQRG4 by Texas Instruments is a Clock Generator IC with 20 terminals, operating at 3.3V supply voltage and 0.096 MHz output clock frequency. It is used in commercial video applications due to its CMOS technology, small outline package style, and wide temperature range from -25°C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,637 parts In-Stock

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Digiode

USA . 1,288 parts In-Stock

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AZTECH Wire

Italy . 859 parts In-Stock

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$6.850

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$6.850

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One Stop Electronics

USA . 633 parts In-Stock

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$12.000

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Corohmni

South Africa . 3,067 parts In-Stock

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$21.891

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Ampacity Inc.

Singapore . 247 parts In-Stock

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$25.000

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Parana Technologies

USA . 1,484 parts In-Stock

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$74.800

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ChromeModa Solutions

Germany . 3,527 parts In-Stock

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$84.045

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$68.917

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IDEA Electronic Components Group

UK . 2,017 parts In-Stock

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$84.045

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$79.843

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$75.640

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Microchip USA

USA . 4,474 parts In-Stock

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DigiPath Technology Company

USA . 1,979 parts In-Stock

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$75.775

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Corphita

USA . 1,386 parts In-Stock

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Overview

Enhance your electronic designs with the PLL1708DBQRG4 by Texas Instruments, a leading manufacturer known for top-quality clock generators. Ideal for a variety of applications, this small outline, shrink pitch package offers a maximum output clock frequency of 0.096 MHz and operates at temperatures ranging from -25°C to 85°C. With a low supply voltage of 2.7V and high supply current of 25mA, this versatile device provides reliable performance and precise timing control. Upgrade your projects with the PLL1708DBQRG4 and experience the value and benefits of cutting-edge technology in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable package for the clock generator, making it easy to integrate into various electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

The clock generator can operate at a higher voltage, providing flexibility in powering options and compatibility with different systems.

Maximum Output Clock Frequency: 0.096 MHz

The high output clock frequency ensures precise timing and synchronization for various applications, especially in video and other multimedia systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the PCB, ideal for compact electronic devices where real estate is limited.

Minimum Operating Temperature: -25 °C

The clock generator can operate in low-temperature environments, ensuring reliable performance even in harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the clock generator energy efficient and reliable in various applications.

Nominal Primary Clock/Crystal Frequency: 27.27 MHz

The high nominal clock frequency ensures accurate timekeeping and synchronization, making it suitable for precision electronic devices and systems.

Technical Specifications

Clock Generators PLL1708DBQRG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Clock Frequency:

.096 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

27.27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

PLL1708DBQRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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