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PGA970QPHPT

Texas Instruments

PGA970QPHPT by Texas Instruments

PGA970QPHPT by Texas Instruments is a 48-terminal analog circuit IC with a supply voltage range of 3.5V to 30V. Operating b/w -40°C to 125°C, it's ideal for automotive applications due to its flatpack package style and surface mount capability in a compact square shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,001 parts In-Stock

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6,001

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Digiode

USA . 651 parts In-Stock

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651

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Distributors (Availability)

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One Stop Electronics

USA . 1,252 parts In-Stock

1+ parts

$5.500

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1,252

$5.500

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AZTECH Wire

Italy . 418 parts In-Stock

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$6.446

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418

$6.446

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Semicontronic

India . 408 parts In-Stock

1+ parts

$6.500

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$6.338

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$6.305

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408

$6.500

$6.338

$6.305

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Parana Technologies

USA . 423 parts In-Stock

1+ parts

$11.788

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$12.189

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423

$11.788

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$12.189

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ChromeModa Solutions

Germany . 1,176 parts In-Stock

1+ parts

$13.245

100+ parts

$10.861

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1,176

$13.245

$10.861

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IDEA Electronic Components Group

UK . 1,163 parts In-Stock

1+ parts

$13.245

100+ parts

$12.583

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$11.920

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1,163

$13.245

$12.583

$11.920

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Corphita

USA . 1,672 parts In-Stock

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1,672

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DigiPath Technology Company

USA . 366 parts In-Stock

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$11.942

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366

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$11.942

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Corohmni

South Africa . 312 parts In-Stock

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Overview

Experience unparalleled quality and performance with the PGA970QPHPT by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers top-notch products like this one, designed for a wide range of applications in the electronics industry. With features like surface mount capability, a wide supply voltage range, and an automotive-grade temperature grade, this product offers exceptional value and benefits to customers seeking reliability and precision in their designs. Elevate your projects with the PGA970QPHPT and discover the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and improving assembly efficiency.

Nominal Supply Voltage (Vsup): 5 V

The 5 V nominal supply voltage is a common and widely used standard, making this product compatible with various systems and applications.

No. of Terminals: 48

With 48 terminals, this product provides a sufficient number of connection points for versatile circuit design and functionality.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding and high-temperature environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold conditions without compromising performance.

Terminal Position: QUAD

The quad terminal position offers enhanced connectivity and stability, making it suitable for applications requiring secure and precise connections.

Width (mm): 7 mm

The compact width of 7 mm enables space-efficient PCB layout and integration, ideal for designs with size constraints.

Other IC type: ANALOG CIRCUIT

Being an analog circuit IC type, this product is suitable for applications that require precise and accurate analog signal processing.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that this product meets the stringent temperature requirements for automotive applications, ensuring reliability and performance in such environments.

Technical Specifications

Other Function Semiconductors PGA970QPHPT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

3.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

PGA970QPHPT Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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